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MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver plating chemistry has received a prestigious R&D 100 Award, recognizing it as one of the top 100 innovations of the past year....
Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we talked about the importance of cleans for 3D ICs. Dynaloy, a subsidiary of Eastman Chemical Company, develops and creates chemistries specifically for the removal of photoresist, etch residues and other polymers. At...
The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as the entire semiconductor industry recognizes (finally) that there is indeed money to be made in the advanced packaging sector. The flip chip and wafer level packaging sessions were full to...
ECTC 2015 returns to my favorite of its three rotating locations at the Sheraton San Diego Hotel and Marina almost exactly one month from now, May 26-29, 2015. This year, the ECTC technical committee has selected 350 papers on topics related to 3D and TSV technologies, wafer level packaging, electrical and...
MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category. Removing lead from solders used...
BERLIN, Germany — January 28, 2014 — At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy — 20% market share of global semiconductor manufacturing by 2020. Presenters from ASML, ASMI,...
The Internet of Things, or “IoT” certainly seems to be the social media buzz phrase of the week. It seems every link I clicked on today took me to a post discussing the IoT. You can blame the flurry of technical blog coverage on recent events like the Trillion Sensors...
What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of interviews and PowerPoints, I was ready for some some hands-on demonstration. Barbara Loferer, marketing manager of Multitest, was concluding an open-house week at the company’s San Jose facility to promote...
On the wall in “The Strip” at Eindhoven’s High Tech Campus is a quote from Albert Einstein “Logic will get you from A to B. Imagination will take you everywhere.” This pretty much defines the mindset of those who are fortunate enough to work in this mecca of R&D. I...
I’ve been reading a lot about the future of the fabless/foundry model. Most articles I’ve seen only count the fab/foundry parts, but I add OSATS to the list, because due to the emergence of 3DICs, it’s a topic of interest to all three segments of semiconductor manufacturing: namely the front-...
