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UCIe can enhance AI chiplet connectivity for efficient, scalable data center solutions. The post Why UCIe is Key to Connectivity for Next-Gen AI Chiplets appeared first on EE Times.
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A chiplet supermarket is still years off, but progress is being made on all fronts. The post Advanced Packaging Moving At Breakneck Pace appeared first on Semiconductor Engineering.
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The need for AI compute power will not go anywhere and Nvidia will thrive, says Pat Gelsinger.
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Send us a text In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced […]
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Nvidia releases another series of security updates for its GPU drivers. https://www.tomshardware.com/pc-components/gpu-drivers/nvidias-mid-january-gpu-driver-update-addresses-several-vulnerabilities-and-exploits
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Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations. The post Chip Industry Investments Kept Flowing In 2024 Even As Some Projects Stalled appeared first on Semiconductor Engineering.
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Send us a Text Message. Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You’ll […]
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As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders for CoWoS-S packaging technology.
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CES 2025 was held last week in Las Vegas. We at Semiconductor Intelligence attended for our tenth CES. The event had over 140,000 attendees and over 4,500 exhibitors. U.S. Consumer Electronics Market Brian Comiskey of the Consumer Technology Association (CTA) presented on technology trends in 2025. The key theme was advances… Read More The post […]
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Fab tools are being fine-tuned for through-silicon via processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging. The post What’s Next For TSVs appeared first on Semiconductor Engineering.
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China’s chip overcapacity prompts U.S. investigation as mature-node foundries face new competition. The post Mature-Node Foundries Face Overcapacity from China appeared first on EE Times.
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Send us a text Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel’s Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and […]
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A response to Daniel Nenni’s “What’s Wrong with Intel?” article, which invited alternative views. At the risk of calling down the forecast universal opprobrium, I’m going to disagree with Dan’s take on the centrality of Intel. I don’t agree that Intel is too big/important to fail or that the US can’t succeed in semiconductors without… […]
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Lam’s Dextro cobot aims to optimize wafer fab maintenance, enhancing precision and reducing errors. The post Fab Maintenance Gets a Robotic Helping Hand appeared first on EE Times.
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Send us a text This episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains why non-destructive, optical […]
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Fujitsu’s Monaka is a monstrous processor with four 2nm compute chiplets, 5nm SRAM, and a massive 5nm IO die. This time, without HBM memory.
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Comprehensive testing is needed to ensure that chiplet systems can withstand extreme conditions. The post Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions appeared first on Semiconductor Engineering.
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Send us a text This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe’s 20 Under 30 program recognizes future leaders in the microelectronics […]
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The US and China trade blows yet again on semiconductor products and minerals, but Chinese companies say they’ll survive.
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Intel CEO Pat Gelsinger departs amid major changes; Intel seeks new leader. The post Intel Will Never Find Another Gelsinger, But Do They Want One? appeared first on EE Times.
