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Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019
JetStep

Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019

Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel formats. The JetStep systems incorporate an option for a new, proprietary submicron lens design, as well as up to 25% increased productivity over the previous JetStep systems. The JetStep wafer stepper will also feature a 20... »

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Signs Strategic Financial Partnership with NIBC Bank

Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce NIBC Bank as a new strategic financial partner. This partnership will enable Trymax to accelerate new technology developments and scale up its manufacturing capacity. The Dutch merchant bank is providing growth capital via a minority equity pos... »

EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing
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EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing

EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide a novel resist processing solution for plasma dicing that is developed for emerging applications, such as Internet of Things (IoT) sensors, MEMS, RFID, CMOS image sensors and thinned memories. This advanced solution, which incorporates the EVG®100 series of resist processin... »

Heterogeneous Integration Drives New Package Developments

Heterogeneous Integration Drives New Package Developments

The high cost of moving to the next semiconductor technology node is changing the role of packaging and assembly in the electronics industry. Heterogeneous integration has become the solution to achieve the economic advantages that were previously met with silicon scaling. TechSearch International’s new report describes these packaging options, including silicon interposers, fan-out-on-substrate... »

SkyWater Chooses Veeco Wet Processer for 3DSoC Collaboration with MIT
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SkyWater Chooses Veeco Wet Processer for 3DSoC Collaboration with MIT

PLAINVIEW, N.Y., Feb. 28, 2019—Veeco Instruments Inc. (NASDAQ: VECO) today announced that SkyWater Technology Foundry has taken delivery of the WaferStorm® single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology. One of the most advanced U.S.-based semiconductor technology foundries,... »

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