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Name

Ziptronix

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Company

A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® and DBI® technologies deliver the industry¹s most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property (IP) has been licensed for a variety of semiconductor applications including backside-illuminated (BSI) sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company holds more than 35 U.S. patents and more than 20 international patents, with more than 45 U.S. and international patent applications pending. For more information, visit http://www.ziptronix.com.

Company Website

http://www.ziptronix.com

Company Type

Process IP

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