3D InCites

3D Integration 101: Explore, Learn, Share

  • Home
  • 3D Topics
    • Design
    • Devices
    • Manufacturing
    • Materials
    • Processes and Technology
    • Test and Inspection
  • Knowledge Portal
    • What is 3D Integration?
    • A Glossary of 3D Packaging Related Terms and Acronyms
    • Technologies Features
    • White Papers
    • Presentations
    • Book Reviews
    • Market Research
    • Standards
  • Blogs
    • Francoise in 3D
    • Packaging IFTLE
    • 3D In Context
    • From Different Dimensions
    • SemiSisters
  • News
    • Events
    • Europe in 3D
  • About Us
    • 3D InCites Technical Advisory Board
    • Acceptable Use Policy
    • 2019 Media Kit
  • 2019 3D InCites Awards
    • 2019 3D InCites Awards Vote
    • 2019 3D InCites Awards Nomination
    • 2019 3D InCites Awards Nominees
    • 2019 3D InCites Awards Sponsorship Opportunities
    • 2018 3D InCites Award Winners
Login
Profile picture of John Lau

John Lau

@johnlauitri-org-tw active 1 year, 7 months ago
  • Activity
  • Profile
  • Groups 0
  • Events
  • Personal
  • Mentions
  • Favorites
  • Groups
  • Profile picture of John Lau

    John Lau wrote a new post, Perspectives on the Cost of Fan-out Wafer Level Packaging vs. Flip Chip Packaging 6 months, 2 weeks ago

    Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled “Cost Comparison of Fan-out Wafer Level Packaging and Flip Chip Packaging,” written by Amy Lujan, of Savansys. […]

  • Profile picture of John Lau

    John Lau wrote a new post, MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained 1 year, 6 months ago

    Multichip module (MCM),  system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book w […]

  • Profile picture of John Lau

    John Lau wrote a new post, Warpage Issues in Fan-Out Wafer Level Packaging 1 year, 7 months ago

    As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t know what they are talking about. Let’s use the chips first […]

  • Profile picture of John Lau

    John Lau wrote a new post, Are Glass Substrates the Next Option for Fan-out Packaging? 1 year, 9 months ago

    As you all may know, in most fan-out wafer level packages (FOWLP) such as embedded wafer level ball grid array (eWLB) by Infineon and STATS ChipPAC, and TSMC’s integrated fan out (InFO), the chip(s) are embedded […]

  • My Articles
  • Pages

    • 2015 3D InCites Awards Winners
    • 2016 European 3D Summit Gala Dinner Quiz
    • 2018 3D InCites Awards Nominees
    • 2019 3D InCites Awards
      • 2013 3D InCites Awards Winners Circle
      • 2014 3D InCites Awards Winners
      • 2015 3D InCites Award Judges
      • 2015 3D InCites Awards Nominees
      • 2016 3D InCites Awards Registration Fee
      • 2016 3D InCites Awards Winners
      • 2017 3D InCites Awards Nominees
      • 2017 3D InCites Awards Winners
      • 2018 3D InCites Awards Nomination Form
      • 2019 3D InCites Awards Nomination
      • 2019 3D InCites Awards Nominees
      • 2019 3D InCites Awards Sponsorship Opportunities
      • 2019 3D InCites Awards Vote
      • Design Tools
      • Devices
      • Inspection/Metrology Tools
      • Manufacturing Equipment
      • Materials
      • Processes
      • Test Tools/Equipment
      • Thank You
      • Thank You
    • 3D by Design
    • 3D IC Community Activity
    • 3D In Context
    • 3D InCites | Stirring up Interest in 3D IC Integration
    • 3D InCites Knowledge Portal
      • A Glossary of 3D Packaging Related Terms and Acronyms
      • What is 3D Integration?
    • 3D InCItes Privacy Policy
    • 3D Summit Gala Dinner Quiz Leaderboard
    • 3D Topics
      • Applications
      • Design
      • Devices
      • EDA Tools
      • Europe in 3D
      • Manufacturing
      • Materials
      • Processes and Technology
      • Standards
      • Test and Inspection
      • Value Chain
    • 3D+
    • About Us
      • 3D InCites Acceptable Use Policy
      • 3D InCites Technical Advisory Board
      • About 3D InCites
    • Account
    • Account
    • Blog Page Example
    • Contact Page Example
    • Cookie Policy
    • Events
      • Categories
      • Locations
      • My Bookings
    • Francoise in 3D
    • From Different Dimensions
    • group Forums
    • Groups
    • Login
    • Members
    • Memberships
    • News
    • Protected Content
    • Protected Content
    • Register
    • Register
    • Registration Complete
    • Subscribe to our Newsletter
    • Test Donation
    • Welcome
    • Whitepaper Download Form
      • Whitepaper Download Thank you
    • Yop Poll Archive
  • Archives

    • February 2019
    • January 2019
    • December 2018
    • November 2018
    • October 2018
    • September 2018
    • August 2018
    • July 2018
    • June 2018
    • May 2018
    • April 2018
    • March 2018
    • February 2018
    • January 2018
    • December 2017
    • November 2017
    • October 2017
    • September 2017
    • August 2017
    • July 2017
    • June 2017
    • May 2017
    • April 2017
    • March 2017
    • February 2017
    • January 2017
    • December 2016
    • November 2016
    • October 2016
    • September 2016
    • August 2016
    • July 2016
    • June 2016
    • May 2016
    • April 2016
    • March 2016
    • February 2016
    • January 2016
    • December 2015
    • November 2015
    • October 2015
    • September 2015
    • August 2015
    • July 2015
    • June 2015
    • May 2015
    • April 2015
    • March 2015
    • February 2015
    • January 2015
    • December 2014
    • November 2014
    • October 2014
    • September 2014
    • August 2014
    • July 2014
    • June 2014
    • May 2014
    • April 2014
    • March 2014
    • February 2014
    • January 2014
    • December 2013
    • November 2013
    • October 2013
    • September 2013
    • August 2013
    • July 2013
    • June 2013
    • May 2013
    • April 2013
    • March 2013
    • February 2013
    • January 2013
    • December 2012
    • November 2012
    • October 2012
    • September 2012
    • August 2012
    • July 2012
    • June 2012
    • May 2012
    • April 2012
    • March 2012
    • February 2012
    • January 2012
    • December 2011
    • November 2011
    • October 2011
    • September 2011
    • August 2011
    • July 2011
    • June 2011
    • May 2011
    • April 2011
    • March 2011
    • February 2011
    • January 2011
    • December 2010
    • November 2010
    • October 2010
    • September 2010
    • August 2010
    • July 2010
    • June 2010
    • May 2010
    • April 2010
    • March 2010
    • February 2010
    • January 2010
    • December 2009
    • November 2009
    • October 2009
    • September 2009
    • August 2009
    • July 2009
    • June 2009
    • May 2009
    • April 2009
    • March 2009
    • February 2009
    • January 2009
  • Categories

    • 2017 Industry Outlook (29)
    • 3D In-Depth (390)
      • 3D Event Coverage (203)
      • Applications (23)
      • Design (39)
      • Devices (59)
      • EDA Tools (28)
      • Europe in 3D (16)
      • Manufacturing (90)
      • Materials (49)
      • Postings (104)
      • Processes and Technology (94)
      • R&D and Collaboration (36)
      • Standards (12)
      • Test and Inspection (39)
      • Value Chain (38)
    • Awards-Design Tools (1)
    • Awards-Devices (4)
    • Awards-Inspection/Metrology Tools (1)
    • Awards-Manufacturing Equipment (4)
    • Awards-Materials (4)
    • Awards-Winner (7)
    • Blogs (809)
      • 3D by Design (38)
      • 3D In Context (77)
      • 3D+ (76)
      • Francoise in 3D (526)
      • From Different Dimensions (112)
      • Packaging IFTLE (10)
      • SemiSisters (6)
    • featured (290)
    • Foundry of the Year (1)
    • monolithic 3D (3)
    • Press Releases (422)
      • Postings (165)
    • Resource Library (87)
      • Book Reviews (3)
      • Market Research (14)
      • Presentations (9)
      • Standards (2)
      • Technologies Features (37)
      • White Papers (25)
    • Sponsored Site Tour (16)
      • Postings (13)
    • Uncategorized (55)
  • Blogroll

    • Documentation
    • Feedback
    • Plugins
    • Support Forums
    • Themes
    • WordPress Blog
    • WordPress Planet
  • Meta

    • Log in

Subscribe to our Newsletter

Events

  • MEMS & Sensors Technical Congress-MSTC 2019
    • 19 Feb 19
  • 2019 IMAPS Device Packaging Conference
    • 4 Mar 19
    • Fountain Hills
  • 2019 3D InCites Awards Ceremony and 10th Anniversary BBQ
    • 6 Mar 19
    • Fountain Hills
  • All Events








Recent Comments

  • Deca » 3D InCites – Transforming the Fan-out Landscape - Deca on Transforming the Fan-out Landscape
  • 3D Plus: Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices – MSA components on Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices
  • Smaller boards, bigger batteries: LG said to join Samsung in using SLP tech | OneDay.Co on Apple selected substrate-like PCBs for its latest iPhones. Who’s next?
  • LG said to join Samsung in using SLP – SHOMI TREND on Apple selected substrate-like PCBs for its latest iPhones. Who’s next?
  • Smaller boards, bigger batteries: LG said to join Samsung in using SLP tech – TECH10MENT on wordpress.com on Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

Site Design By

Media Partners

                 
Copyright © 2018 3D InCites. All rights reserved. | Privacy Policy
This site uses cookies: Find out more.