From Different Dimensions

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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

CHIPcon Community Member Preview

The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies, and business trends. IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference CHIPcon. As the world’s leading semiconductor companies continue to push...

Media Hub Rendering

SEMICON West 2023 Member Preview

SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries gather July 11-13 at the Moscone Center in San Francisco. The event focuses on key challenges affecting the global microelectronics industry which include Supply Chain Disruptions, Climate Change, and Talent...

SEMI 3D & Systems Summit Community Member Preview

SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design and Photonics Leading experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, next week June 26-28, 2023 in Dresden, for insights into the latest heterogeneous...

urban mining for critical minerals

Sustainability 101: Critical Minerals and Urban Mining

In June, the GreenBiz Circularity conference came to Seattle. With the conference site about 15 miles from me, I had to go. The last day included an in-depth session called “Recovering Critical Minerals from E-Waste and the Untapped Urban Mine.” The speakers represented companies that are household names—Google, Intel, Best...

ESG

New Facility Helps Drive Veeco’s ESG Progress

At Veeco, we develop tools and processes integral to fabricating and packaging advanced semiconductor devices. As a vital link in the global semiconductor supply chain, we understand the importance of sustainability to the entire semiconductor ecosystem. As such, we are committed to advancing our corporate sustainability efforts by paying close...

Community Member Monthly Highlights — May

SEMI and TechSearch International announced that the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, artificial intelligence...

Building a Chiplet Ecosystem

The semiconductor industry’s decades-long adherence to Moore’s Law doctrine of doubling transistor counts on monolithic devices every 18 – 24 months has been amazingly successful. It’s now possible to integrate tens of billions of transistors onto a monolithic die whose area may be hundreds of square millimeters. The resulting chips...