From Different Dimensions

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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

3D ICs Eliminate the Memory Wall

The adoption of 3D ICs allowed the elimination of the “Memory Wall” using a new memory architecture and through silicon via (TSV) technology. While individual ICs became faster with each process node, the communication between the chips was constrained by limited pin counts, power hungry I/Os, and PCB-space limitations. Assembly...

Probe Test for 3D Integration: A Thousand Mile Journey

When we look back at the last 10 years, it’s really been a series of baby steps to move the commercialization of 3D integration technologies forward. There is no single pivotal event that catalyzed the 3D evolution. Like the Chinese philosopher, Lao Tzu said, “do the difficult things while they...

3D Powered: From Image Sensors to Artificial Intelligence

Paul Werbaneth, Nor-Cal Products The widespread deployment of 3D stacked CMOS Image Sensors (CIS) in consumer electronics, namely smartphones, by handset makers domestic (Apple, iPhone) and overseas (Samsung, Galaxy), is certain proof that 3D integration technologies pivoted over the last ten years from being something useful only for fairly esoteric...

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges. This article looks at AP trends from a lithography standpoint and proposes solutions to associated lithography challenges. The need for advanced packaging solutions is greater...

European 3D Summit 2018: Fraunhofer Tour and Presentations 

This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a lab tour of the Fraunhofer Institute, whose 18 high-performance centers collaborate with companies, universities and other research institutes in Germany.  All pictures and diagrams courtesy of Fraunhofer IZM. The Fraunhofer...