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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

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European 3D Summit 2018: Fraunhofer Tour and Presentations 

This year’s European 3D Summit in Dresden, which highlighted “Heterogeneous Integration Driving 3D”, was led off by presentations and a lab tour of the Fraunhofer Institute, whose 18 high-performance centers collaborate with companies, universities and other research institutes in Germany.  All pictures and diagrams courtesy of Fraunhofer IZM. The Fraunhofer IZM presentation was introdu... »

Vandewalle Pieter

Can We Thank Aristotle for Heterogeneous Integration?

A couple of years ago we may not have predicted that in 2018 there would be a growing demand for high-end chips specifically for global cryptocurrency mining. Those taking part in this search for hashes have a glimmer in their eye similar to those consumed by the hope and frenzy of a gold rush. The rush of getting to the answer first, and of course the alluring reward paid in Bitcoin, is driving p... »

3D Commercial Products Ericbeyne003

Breakthroughs in 3D Chip Technology Lead to Cooling With Microfluidics and 3D Printing

  2017 saw a clear breakthrough for 3D chip technology in commercial products. Before then, the industry had looked rather skeptically at 3D, but now it is beginning to realize that 3D does not necessarily have to cost more money. Better still, it creates new possibilities and opportunities. 3D on the market In 2017 we saw 3D chip technology start to appear in a range of different commercial ... »

2018 Industry Outlook: It’s Time to Get Serious about 5G

While the entire semiconductor industry is buzzing about explosive and sustained growth well into the 2020s driven by smart everything (homes, cities, industry), automotive electronics, artificial intelligence and more, what’s truly exciting is how we are going to support the connectivity of all those applications. 5G is where it all comes together. Without it, connecting all this disparate data... »

Photo Christophe 2016

A Material Solution for the Growing 3D Imaging Market

With emerging markets developing for augmented reality (AR), virtual reality (VR), facial-recognition security systems, advanced human/machine interfaces and other 3D imaging applications, the need for 3D camera systems is booming. These 3D cameras require CMOS image sensors that are capable of working in the near-infrared (NIR) spectrum. In 2018, a towering wave of 3D imaging and sensing products... »

Ram Trichur Bio Photo

2018 Outlook for Advanced Packaging Materials

Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by the need to deliver highly int... »

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A Tribute to Gilles Poupon, CEA-Leti’s Advanced Packaging Pope

Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days during which we honored Gilles Poupon, the Advanced Packaging “Pope” of CEA Leti. Upon his retirement at the end of November 2017, somehow an era ends. I have known Gilles for quite a long time: He reminded of the first time we met. It was 2003 in Munich. Gilles was a member of the CEA delegatio... »

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MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained

Multichip module (MCM),  system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at the very least, a book written about them. However, herein I would like to give these technologies very simple descriptions. if you don’t mind. MCM MCM integrates different chips and discrete components side-by-si... »

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Warpage Issues in Fan-Out Wafer Level Packaging

As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t know what they are talking about. Let’s use the chips first, face-up fan-out wafer level packaging (FOWLP) approach as an example. Also, let’s consider three redistribution layers (RDLs). The process flow is schematically shown in the figure b... »

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Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Mar... »

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