From Different Dimensions

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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

Heterogeneous Integration Component Flavors SEMI ASMC 2019

“It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected. The availability of large functions, combined with functional design and construction, should allow the manufacturer of large systems to design and construct a considerable variety of equipment both rapidly...

Extending Moore’s Law through Advanced Packaging

The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form...

Advanced Heterogeneous Packaging Solutions for High Performance Computing

Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs)...

Advanced Packaging: Game Changer for Semiconductor Revolution

Advanced packaging has entered its most successful era boosted by a need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory & computing, artificial intelligence (AI) and high-performance computing (HPC). The market today is dominated by large integrated device manufacturers (IDMs), such...

Thank 2.5D Interposer Technologies for the Success of 3D ICs

Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may have been the commercialization of 2.5D interposer technologies? Arguably, 3D and silicon interposer are very different technologies, with a common denominator that happens to be the through silicon via (TSV)....

3D Integration Enables More than Moore Technologies

Looking back at the last 10 years, it is very difficult to choose one single event that was the most pivotal for commercializing 3D integration technology. There have been many prior events that have driven 3D integration and aligned the whole industry in migrating from monolithic 2D to heterogeneous and...

Breakthroughs in 3D Stacked FinFETS and 3D Sequential Integration

The annual International Electron Devices Meeting (IEDM) presents the latest developments in electronic device technologies focused on advanced scaling, heterogeneous integration, quantum computing, and wide bandgap devices. Among several excellent papers on 3D integration were two papers on 3D sequential integration, long the holy grail of 3D integration because of...