From Different Dimensions

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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

How To Turn Technical White Papers into Lead-gathering Machines

Technical white papers are a mainstay of marketing plans for B2B technology companies. Even before the Internet made content marketing a thing, companies produced technical white papers to present at conferences and symposiums, or for publication in trade publications and journals. Now that more B2B technology companies are engaging in...

Sustainability 101: Chemicals of Concern – Beyond RoHS

Semiconductor manufacturing involves many “chemicals of concern,” or compounds that are hazardous to human health and the environment. The hazardous compounds fall into several categories: Solvents—etchants, cleaners, and similar substances that are rinsed off the wafer Process chemicals—solids, liquids, or gases that undergo chemical reactions to form either sacrificial or...

You’ve Been Through an M&A – Maybe It’s Time to Rebrand?

Much consolidation has happened in the semiconductor industry over the last decade or so. And it’s not over yet if recent news is anything to go by. By consolidation, I’m referring to specific mergers and acquisitions (M&As) between companies making similar products, materials, or devices. It’s happened in the materials...

Is Humpty Dumpty Really Broken?

Can the USA wrestle back Front- and Back-end Semiconductor Manufacturing? Humpty Dumpty Humpty Dumpty sat on a wall Humpty Dumpty had a great fall All the king’s horses and all the king’s men Couldn’t put Humpty together again Recently, Congress has been tossing ideas about investing $Bs into the high...

ESiPAT-TC Team Prepping for Successful In-Person Event

Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe. This is a great opportunity to meet with members of the SEMI integrated Packaging, Assembly and Test Technology Community (SiPAT-TC), pioneered by the European chapter (ESiPAT-TC) established in 2016....