Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.
Community Reflections: From Chaos to Opportunity
ASE, Inc. CEO, Dr. Tien Wu, has often referred to Sun Tzu’s legendary quote when describing semiconductor market volatility, “In the midst of chaos, there is also opportunity.” This rang particularly true over the past few years. Undoubtedly, the semiconductor chip emerged heroic from the chaos of pandemic times, underscoring...
Sustainability 101: The Role of Secondary Markets in Greening the Semiconductor Industry
It’s a great time to be selling secondhand or refurbished goods. Individuals wanting to adopt greener lifestyles often turn to secondary markets for everything from clothing to furniture. The dual benefits of saving money and saving the planet are very appealing. Gently used items can be just as functional and...
How MTP Technology Improves 3D Heterogeneous Integration
High-performance computing, communications, mobile, automotive, industrial, medical, and defense systems increasingly require 3D heterogeneous integration of many diverse components to improve their performance and functionality. These diverse components include high electron mobility transistors (HEMTs), heterojunction bipolar transistors (HBTs), power transistors, gate drivers, photonics, sensors, hardware assurance devices, capacitors, inductors, filters,...
Wafer-Level Packaging Is Well-Positioned for Growth
Wafer-level packaging (WLP) saw significant growth in 2021 due in large part to the increased performance needs of data-driven 5G network devices. Because WLP is performed when chips are still on the wafer, ACM Research has been able to leverage and adapt our expertise in front-end solutions to address high-volume...
Another Strong Year Ahead for Hybrid Bonding Thanks to Heterogeneous Integration
While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable bright spot has been within the semiconductor industry, where fab spending in new process equipment reached a new record high of more than $100B according to SEMI. This spending growth...
Staying Ahead of the Advanced Packaging Technology Curve
Advanced packaging technology enables continued performance scaling across applications, and it is clear that the coming generations of mobile and edge computing, cloud computing, and distributed high-performance computing will require heterogeneous chip integration technologies. To accommodate demanding performance and scaling requirements while also meeting stringent technical specifications for speed, bandwidth,...
Two Pillars: The Path to Building a Responsible Innovation Company
The most successful companies over the next couple of decades will be those that practice responsible innovation. They will seek to build technology that benefits all stakeholders, and try to foresee and avoid harmful unintended consequences. But how? Doing all that requires thinking in ways that refute Silicon Valley’s conventional...
Making the Impossible Possible
Building a Better Future After a Year of Surprising Growth and Rising Demand The new year is always a wonderful time to take a deep breath, hold it and reflect on the past 12 months while planning for the year ahead. In the semiconductor industry, we have never seen a...
Breaking Records in 2021 Despite COVID-19
2021 was a record year for Trymax Semiconductor Equipment B.V.; an all-time high. Despite the problems we encountered due to COVID-19, the order intake was very high. When COVID-19 appeared early in 2020, many companies were forced to look at their internal situation, especially their spare capacity, but also to...
Protecting Devices During a Supply Chain Shortage
Spending 2021 as president, and with my recent appointment to President and CEO of Delphon as of January 1st, 2022, I couldn’t be any prouder of my organization. Our team showed tremendous tenacity this past year. We not only survived tremendous headwinds caused by supply chain and logistics challenges but...
