Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
Day Two of 3D ASIP and even though the conference opened with declarations that “3D is here” it’s clear after attending the sessions and hearing what all the presenters have to say, that this is a multi-dimensional situation. First, there are the vendors and suppliers, who have a lot at...
Got up before dawn to catch the 6am flight to SFO for RTI’s 3D Architectures for Systems Integration and Packaging Conference (3D ASIP), and arrived just in time to catch the tail-end of Xilinx’ Ivo Bolson’s presentation. It was ironic (or strategic?) that Ivo started things off, because it was...
Word on the street is, if 3D is serving a niche market, it’s going to be a big niche! At least that was what Subramanian Iyer reported back from the 3D Panel he moderated on December 6 during IEDM 2011. The panel’s ultimate goal was to address the overall theme...
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for start-ups. Everyone who reads my blog knows that. So it’s no surprise that I’ve had Ziptronix on my radar since the first press tour in 2007. I was impressed by...
We’ve been hearing so much lately from the 3D integration cheering section, that it’s actually hard to believe that there are folks who remain skeptical to the inevitability of 3D integration as a mainstream technology. But on December 6, during the evening 3D panel session at the 2011 IEDM, held...
Two weeks ago, wearing my Chip Scale Review Sr. technical editor hat, I attended (along with 11 other journalists) an exclusive press conference launching a new electronic interconnect company, Deca Technologies, which claims to have developed disruptive manufacturing processes based on its sister company, SunPower’s, solar cell wafer processes, rather...
With all the latest hubbub about FinFets (or as Intel calls them, TriGate transistors) , there seems to be some confusion in terminology, leading to confusion in who’s doing what first. First and foremost, the technology Intel claims to have pioneered is 3D transistors, also known generically as FinFets. TSMC...
Once again I find myself using this blog space to venture outside the scope of normal coverage to offer some thoughts and condolences on the passing of one of our industry’s own – Steve Adamson, Marketing Manager at Asymtek, who lost his battle with pancreatic cancer last Friday evening, Oct...
Are you going to this year's MEMS Executive Congress? I was invited, but unfortunately won't be able to attend. I'm sad about that - it was a great event last year and I learned alot about the synergies between MEMS and 3D ICs. As you probably know, MEMS are already...
I had a bit of an “aha!” moment yesterday at the MEPTEC 2.5D, 3D and Beyond Conference, with regard to the whole supply chain conundrum that seems continues to be part of the 3D commercialization hold-up. After listening to Sunil Patel of GlobalFoundries and Rich Rice of ASE discuss their...