Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
It’s going to be a busy 3D week here at IMAPS Device Packaging Conference, in Scottsdale AZ. So I’m going to attempt to keep up with everything with short, daily blog posts. I can’t promise to cover everything in detail (hey, if you wanted that, you should have come yourself!)...
I usually never miss the Academy Awards, but this year I am in Germany visiting Fraunhofer IZM ASSID in Dresden for a 3D InCites sponsored site visit, and decided against getting up at 2am to see first hand who won Best Picture. I was invited by M. Juergen Wolf, who...
I attended the annual IMAPS local chapter lunch here in Arizona last week and got the low-down on the semiconductor market and forecast from Bill McClean at IC Insights. Bill does a great job at showing the whole picture – comparing the Worldwide GDP and showing the correlation between it...
Really, it all boils down to simple economics. I’m referring to WHY the road to 3D is taking as long as it is to reach commercialization. We’ve convinced the engineers of the technology benefits. Now it’s time to convince those who hold the purse strings: the management. I had an...
Ever since I put on the editorial director hat for 3D-ICs.com, which aggregates 3D technology news, blogs and papers, and categorizes them as either TSV and 3D packaging or monolithic 3D, I’ve been trying to wrap my head around the differences between 3D TSVs and monolithic 3D integration technologies. I’ve...
Last week, SEMATECH and ISMI announced they would be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing (HVM) maturity issues for 3D IC manufacturing. This is a significant step in SEMATECH’s goal to accelerate the 3D...
My head is spinning. I just spent a few hours reading through all the latest 3D technology posts on various semiconductor news websites; something I find myself doing a lot more ever since I took on 3D-ICs.com. As editorial director of that site, it’s my job to sift through all...
Although I don’t often get to attend the GSA 3DI IC Workgroup meetings personally, I am on the mailing list and like to share the notes when they come my way. Harrison Beasley, technical working groups manager sent a brief review of the July 12 meeting that took place at...
I knew when I visited EV Group’s world headquarters in Schärding, Austria two years ago that there was an ongoing story here and I would be returning to write about the next phase of growth. (This time, we’ll be catching it all on video as well.) What I didn’t anticipate...
When I was in high school and then in college, I used my mother’s Smith-Corona MANUAL typewriter to write all my English and journalism papers. (Yes, electric typewriters already existed, but we were "slow adopters" — aka "cheap" — heck, we didn’t even have a color TV until 1981) Those...
