Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
I did NOT see this one coming. For months, unconfirmed rumors have been flying about TSMC courting Apple, in hopes of getting its A6 processor business. Conjecture was that one of the reasons they were building out assembly and test to provide end-to-end 3D IC manufacturing was to ultimately win...
There’s been lots of news lately about the transition to 450mm wafers, and I’m wondering, is it only me, or are there others who are amazed at how little mention there is on its impact in the assembly and packaging world. It’s like the front-end has forgotten that the back-end...
When I first launched 3D InCites in 2009, it was with the intention of creating an online resource for the semiconductor industry that could be relied upon to provide comprehensive information for 3D IC and 3D Packaging technologies. 3D technologies were still far from commercialization, but it was already apparent...
Well this news took a bit of the wind out of my sails this week. I received a press release from TechSearch International titled Manufacturing and Business Issues Push Out Adoption of 3D TSV: Companies Seek Alternatives for 3D TSV. I like Jan Vardaman, TechSearch's CEO, and when we meet...
I’ve been reading a lot about the future of the fabless/foundry model. Most articles I’ve seen only count the fab/foundry parts, but I add OSATS to the list, because due to the emergence of 3DICs, it’s a topic of interest to all three segments of semiconductor manufacturing: namely the front-...
Unfortunately, it’s not enough to have customers clamoring for them (3D devices), or that processes, materials and equipment are ready (or almost) and waiting for implementation to fine-tune them; and that EDA and test vendors working feverishly to fill in the design and test gaps; nothing will roll until the...
I've got two questions for readers, based on recent headlines from TSMC. First of all, are TSMCs activities in building out capacity for 3D ICs spurring leading Taiwanese assembly and test houses to increase capacity as well? That’s what’s implied in this news item on CENS.com, which reports that ASE, SPIL...
The R&D centers were out in full force at this year’s SEMICON West, presenting on their latest activities in all areas of 3D technologies, from 3D transistors, to 3D ICS, to full-blown 3D Systems. I was able to attend a smattering of presentations at events hosted by imec, CEA-Leti, SEMATECH...
As much as the industry is intent on holding 3D technologies to a narrow definition, I'm compelled to remind readers that before 3D had to include a TSV interconnect to be considered a 3D technology, and before the term 2.5D had been coined, 3D packaging was already being touted as...
Tish LeBlanc, from TI: "How's your SEMICON West going? Me: "I was just trying to put it into words." It's Thursday, and another SEMICON West (my seventh) is winding down, and its the first time I've found time to write since Monday evening. As always, it's been a whirlwind of...