After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why I chose to focus 3D InCites on the advanced packaging segment of the semiconductor industry. The technology is fascinating and varied, the conversation is inspiring, and the people know how to have a... »
Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountain Hills, AZ, it became clear how rapidly that hierarchy has shifted. From the keynotes to the panel discussion, to the Global Business Council session, speakers portrayed heterogenous integration (HI)... »
Has it already been 10 years since my first business partner, Leo Archer, and I started 3D InCites? When we first conceived of the idea in 2009, I had no idea what I was getting myself into or that 10 years later, 3D InCItes would be so well recognized in the industry, and that I would be known as the Queen of 3D. Leo and I parted ways in 2011, and after a year of going it alone and seriously thin... »
The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable from start, others were neck-and-neck, with the front runner changing on a daily basis. What was most exciting to me, however, was how many new participants we had, and how well they did. So, from almost-to-close-call to we-never-saw-that-one-coming, here’s my analysis of th... »
The semiconductor industry could learn a few things from Santa’s elves. How about devices that package themselves? These guys may be onto something. Check it out. »
This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component, subassembly, circuit board, through to test and measurement, and enclosures, switches, the works. While my focus for this trip was SEMICON Europa, I took the long way to hall A4, wandering through the E... »
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any reason to exist. Think about that for a bit. There’s a reason “Semiconductors drive smart” was SEMI’s chosen theme for the event. Rather than attend all the sessions in the tech arena, I cho... »
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced packaging, and one that tied everything all together. At all of these events, the themes were consistent: advanced packaging rules; automotive and IoT is driving the train, and artificial intelligence and machine learning are the ones to watch on the hype... »
The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the MEMS and Sensors Executive Congress, in Napa CA. The winner gets a free table next year and is expected to share their progress. After a rapid-fire session of presentations and time to visit demo tables, their fate is in the hands of the attendees who have 24 hours to vote for t... »
Just over a year ago, Napa Valley was in flames, and the annual MEMS and Sensors Executive Congress (MSEC) had to be relocated from the Silverado Resort and Spa, located on the fringes of the Atlas Fire, to its sister hotel in San Jose, CA. So, it was with a bit of trepidation that I drove the switchbacks from Sacramento Airport to Napa to attend MSEC 2018 at the Silverado, October 28-30, 2018. Wh... »
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