Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
14 years ago, I had an idea to create a content platform devoted to the advancement of semiconductor 3D Integration technologies. I called it 3D InCites because to “incite” means to “stir up interest in”. I also liked the play on 3D IC. I started attending industry events and blogging...
The donations are in, the expenses tallied, and we’re excited to report that the 3D InCites DEI Fund has grown to a healthy $61,672.52 thanks to the generosity of our 2023 3D InCites Awards sponsors, our annual Mural Sponsors, and our second annual Hike for DEI, and our event partners,...
What an energizing week I had at IMAPS DPC 2023! I’ve said it before, but it’s worth saying again, the IMAPS Device Packaging Conference (IMAPS DPC) is one of my favorite annual events, and this year’s edition did not disappoint. There was a record turnout, great keynote talks, panel discussions,...
This is by far my favorite blog post to write each year; the one where I get to announce the winners of the 3D InCites Awards. This year we had 36 nominees for 10 2023 3D InCites Awards categories, representing companies from around the world, all working to advance the...
At YES, we are positioning ourselves for the growth that is expected to flow from the on-shoring of semiconductor manufacturing. As a global company ourselves, we understand the need for local manufacturing to address supply chain challenges. The governmental incentives persuading large multinational companies to base their manufacturing in the...
Forget Christmas. For us at 3D InCites, the IMAPS Device Packaging Conference (IMAPS DPC 2023) is the most wonderful time of the year. As Official Industry Partners, we work together to create a very memorable event. We’ve got professional development courses and technology sessions; awards presentations and the annual Global...
I got the notification while I was visiting with my family in Vermont over Christmas: Congratulations from Buzzsprout for 7500 podcast downloads! I was very excited because, in the podcast world, that’s a significant achievement. Did you know that there are over 2.4 million podcasts with over 66 million episodes...
What a week! From keynotes, panel discussions, and podcast interviews, to booth parties and after-hours networking – the week at SEMICON Europa was all about making connections. For us, that meant hosting our first-ever 3D InCites member social event on Monday, November 14 at the iconic Augustiner Keller. Guests from...
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the spirit of community this organization has cultivated over the years. It’s one of the reasons there is so much synergy between IMAPS and 3D InCites, and why we have become...