Why We need Lower Cost TSVs and How to Get Them
Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power dissipation. Used for years in microelectromechanical systems (MEMS), compound semiconductors, and image sensors, TSVs are now also in mainstream production for 2.5D interposer technologies, and for stacking die to create high-bandwidt... »
Recent Comments