francoiseIn3D_logo

Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.

MEMS-IMAGING-GRENOBLE-2018013_1537396033_optimized MEMS-IMAGING-GRENOBLE-2018005_1537396019_optimized MEMS-IMAGING-GRENOBLE-2018017_1537396039_optimized

Will Fully-Autonomous Vehicles Ever Take Over Our Roads?

At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the feasibility) that fully-autonomous vehicles are poised to take to the roads in the next two years. In reality, fully-autonomous vehicles won’t be rolling off the assembly lines any time soon, if ever. The readiness of sensor systems and the high cost of manufacturing these cars ... »

IMG_0229 IMG_0231 IMG_0364 IMG_0373 IMG_0267 IMG_0323 IMG_0262 MEMS-IMAGING-GRENOBLE-2018012_1537396031_optimized MEMS-IMAGING-GRENOBLE-2018009_1537396026_optimized

MEMS, Imaging, and Sensors Summits Show The Power of Collaboration

Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the pleasure of gathering with 380 attendees from 21 companies from around the world to discuss the latest trends and technologies in MEMS, imaging, and sensors. Topics of discussion included the latest MEMS, imaging, and sensor market trends; application spaces such as automoti... »

KLA-Tencor_Defect challenges KLA-Tencor_Kronos 1080_ecosystem KLA-Tencor_ICOS F160_features KLA-Tencor Packaging Portfolio

Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It

It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has shifted to advanced packaging and heterogeneous integration to meet demands for microelectronics devices targeting the internet of things (IoT) market. These devices perform a variety of functions (sensing, processing, remembering, transmitting) i... »

IMG_9651 IMG_9650 IMG_2063_btr_Fav1

Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology

It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous integration (HI) approaches became more advanced, metrology processes began creeping into back-end process control, where measurement becomes trickier and more diversified. As part of the 3D InCites Award Winners series, I spoke wit... »

warehouse 2 JessicaG_111 semisisters4

How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story

The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the situation is even worse. These grave statistics came to light during a recent panel discussion during SEMICON West, in its Workforce Pavilion. Here, Jessica Gomez, co-founder and CEO of Rogue Valley Mic... »

IMG_9592

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018

Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove the conversations I had with everyone I spoke with at and around SEMICON West 2018. Turns out people had lots to talk about. AI and Machine Learning I often think back to the 2010 MEMS Executive Summit in Scottsdale Arizona, when Karen Lightman declare... »

IMG_9653

Volumes Matter and Other Conversations from SEMICON West 2018

The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors are the hottest game in town. Here’s how some of these trends are impacting suppliers that I spoke with at SEMICON West. The importance of purity While Entegris is agnostic to megatrends, Jim O’Neill, CTO, still... »

Why We need Lower Cost TSVs and How to Get Them

Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power dissipation. Used for years in microelectromechanical systems (MEMS), compound semiconductors, and image sensors, TSVs are now also in mainstream production for 2.5D interposer technologies, and for stacking die to create high-bandwidt... »

Screen Shot 2018-07-16 at 12.49.20 PM IMG_9599 copy IMG_9647 copy

What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?

The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration nomenclature for package architectures, it should be 2D or 3D. The Back Story The term “2.5D” has been a topic of debate in the advanced packaging world ever since it was first added to the industry... »

IMG_9557 IMG_9559 IMG_9663

SEMICON West 2018: Smart Starts Where?

Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s event was… for lack of a better word… different. All I could think of as I looked around the Moscone Center upon arrival was “ready or not, SEMICON West 2018 is here, emphasis on ‘or not.’” While I generally endeavor to paint a rosy picture, I have to remember that ... »

Page 3 of 5412345»