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An Advanced Packaging Applications Forum presented by Rudolph Technologies
美商陸得斯科技股份有限公司台灣分公司
Focused exclusively on advanced packaging applications, this half-day Rudolph Yield Forum™ provides process engineers, fab managers and tool owners with new application data and process control techniques that address current wafer-level packaging challenges.
Agenda Topics
Print, Monitor & Measure 2µm RDL
Fan-out Wafer Level Packaging Challenges
Process & Control of Cu Pillar Bumps
Kerf Control on Reconstructed Wafers
Process Control for MEMS Applications
To learn more and register, visit the Rudolph Technologies Yield Forum website.
