July 10-12, 2023
Westin Tyson’s Corner | Washington DC
Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, July 10-12, 2023, at the Westin Tyson’s Corner just outside Washington DC. This workshop will be bringing Government agencies, the DIB (Defense Industrial Base), and Advanced Packaging and Assembly providers together to discuss their efforts to onshore advanced packaging. The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs which address US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain. Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III/Printed Circuit Board Executive Agent), DARPA and SRC will be briefing on their advanced packaging programs.
The workshop will feature two days of focused sessions, keynote presentations, a panel discussion, and a variety of networking opportunities. The event will kick off on Monday with a pre-program day filled with 2-hour professional development courses and working groups addressing a variety of topics relevant to the onshoring of advanced packaging.
PROGRAM HIGHLIGHTS
PROFESSIONAL DEVELOPMENT COURSES
- PDC1: Failure Analysis in Semiconductor Package Assembly
Instructor: Tom Dory, Fujifilm Electronic Materials - PDC2: Course Topic Soon
KEYNOTE SPEAKERS
- CHIPS – Erik Lin, Dept. of Commerce/NIST
- DPA/Title III and ICAM/IBAS Activity – Anthony Di Stasio
- Next Generation Microelectronics Manufacturing (NGMM) – Dr. Carl McCants, DARPA
- DoD ME Commons – Dr. Dev Shenoy
WORKING/DISCUSSION GROUPS
- Chiplets
- IC Substrates
SESSIONS
- Government Agencies
- DARPA
- Defense Industrial Base
- Advanced Packaging & Assembly
- Workforce Development
| Register Today (US Residents Only) |
