05/18/2022 -8:00 am - 9:00 am

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Join SEMI MSIG as we bring you the latest developments in packaging technologies and miniaturization for MEMS and sensors from the industry leaders at ASE Group.
MEMS technology has been recognized as key components in MedTech, Mobility and communications products. This has caused additional pressure on packaging and test, creating challenges to achieve higher performances and tighter packaging tolerances.

Hear from Dr. Chris Huang from ASE how packaging is meeting requirements, plus enabling technology breakthroughs.


About the Speaker

Dr. Chris Huang, currently with ASE, has a wide-ranging experience in the MEMS engineering field. He is currently Deputy Project Manager for MEMS & Photonics Engineering at ASE, focused on MEMS and optical sensor packaging in automotive applications as well as smart sensor and smart system technologies. Previously, he has worked at Asia Pacific Microsystems, a pure-play MEMS foundry.