05/10/2016 -1:00 pm - 2:00 pm

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Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. Hosted by Solid State Technology, this webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Andrej Ivankovic
Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing
Yole Développement

Mike Kelly
Senior Director 3D TSV Development
Amkor Technology

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