Yole Développement and NCAP invite you to join them for the Advanced Packaging & System Integration Technology Symposium, 2020 edition in Suzhou, China, this year.
The agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times , organized within Suzhou’s advanced packaging ecosystem. By combining their technical and market expertise, both partners invite you during two days to meet leading executives and gain an in-depth understanding of the advanced packaging industry evolution.
Advanced packaging processes are at the crossroad of all semiconductor manufacturing process steps today. For the overall semiconductor companies, advanced packaging is strategic to answer to the industry evolution and ensure the development of their activities. With more and more functionalities, companies have to manage their ability to integrate more and more components on a same die and propose a final product with a high reliability level.
At SYNAPS, 2020 edition, NCAP and Yole Développement invite you to dive deep into the advanced packaging technologies, understand the latest innovations and discover new business opportunities.
CALL FOR PAPER
Submit your abstract (200 words max.) for the 6th edition of the Symposium!
Please send it to (email@example.com) by January 10, 2020. Your abstract can include one or two illustrations (graph, images…).
Find more information in the “call for paper” section here.
Tickets for the SYNAPS 2020 are now available!
You can benefit from an early bird rate by registering now. Each ticket will give you access to all the symposium, lunches, coffee breaks, networking time and a fine cocktail and diner. It is only 350€ until February 28, 2020!