Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI expanded the scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia. This year, SEMICON Southeast Asia takes place in Penang, Malaysia.
Assembly and Packaging Forum
Emerging Packaging Solutions for Computing, Mobility and Internet of Things (IoT) platforms
This session will provide the latest insights & technology trends for automotive, MEMS, Computing, wireless and IoT devices. Key packaging challenges for each application in reference to process integration, reliability, yield, cost, thermal management and supply chain will be discussed by the experts from the leading fabless, integrated device manufacturer, foundries, outsourced test & assembly service providers and research institutes. Also in this forum, the roles of the semiconductor players in South East Asia region in driving Research & Development, and implementing the application specific solutions will be discussed and debated.