Advanced system-in-package (SIP) has been added to the advanced packaging lexicon and covers a variety of system-in-package (SiP) subsets including aminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP, and modules.
MAPS established the Advanced SiP conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2019 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2019 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.
Featuring two and a half days of technical sessions, panel discussions, exhibits, and local networking activities, Advanced SiP 2019 will provide dynamic learning and technology updates on SiP trends and new engineering innovations from the industry’s global SiP leaders.