The IMAPS 50th Annual International Symposium on Microelectronics takes place October 9th to 12th at the Raleigh Convention Center in Raleigh, North Carolina.
You will find an IMAPS 2017 program with technical sessions balancing between emerging, new and mature topics, and a large cross-section of vendors exhibiting their products and technologies in the exhibition hall. Early Registration & Hotel Deadlines: September 8, 2017.
The IMAPS committees and many dedicated volunteers have been working together over the past six months to prepare for the 2017 Symposium with an emphasis on bringing exciting topics that are relevant within the microelectronics community. This year’s Technical Committee, chaired by Mary Cristina Ruales Ortega, has prepared technical sessions with topics on fan-out wafer level packaging; embedded packaging; heterogeneous & complex system packaging; advanced CMOS nodes; miniaturization of bio-devices; 3D technologies; wire bonding; additive manufacturing; materials; and much more.
Complementing the technical sessions, we are also planning multiple Professional Development Courses (PDCs) with a variety of topics bound to enhance and broaden your technology portfolio. This will be held on Monday, October 9, prior to the kick-off of the technical sessions.
The IMAPS Exhibition returns featuring a 2-day show floor with more than 120 exhibit booths, featuring companies and research labs that will showcase a vast array of new products serving all segments of the microelectronics industry, including Consumer, Healthcare and Biomedical, Military, Aerospace, Computing, and Automotive/Industrial. Browsing the exhibit hall and talking to the exhibitors are bound to be exciting and we hope that this enables you to learn the latest and greatest solutions to the changing needs of your business and research.
