11/08/2016 - 11/10/2016 -All Day

Location: TBD

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The IEEE International 3D System Integration Conference (IEEE 3DIC 2016) will be held in San Francisco, November 9-11, 2016 at the Park Central Hotel. 3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The full schedule is now available. 

About IEEE 3D System Integration Conference (IEEE 3D IC) 
This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the IEEE CPMT sponsored 3D System Integration Conference held in 2003 & 2007 in Munich. After the first combined conference in San Francisco in 2009, the 2nd IEEE International Conference on 3D System Integration was held in Munich in 2010, the 3rd conference in Osaka in 2012, the fourth conference in San Francisco in 2013 and the fifth conference in Cork in 2014.

Sponsoring Organizations :
ASET (Associate of Super-Advanced Electronics Technologies, Japan)

Sponsoring Institutions:
Fraunhofer IZM – Munich
Tohoku University
North Carolina State University

 2016 Conference Co-Chairs: Paul Franzon (NCSU), paulf@ncsu.edu Robert Patti (Tezzaron), rpatti@tezzaron.com