The Electronic Design Processes Symposium (EDPS 2014), in its 21th year, fostered the free exchange of ideas among the top thinkers, movers, and shakers who focus on how chips and systems are designed in the electronics industry. It provided a forum for this cross-section of the Design community to discuss state-of-the-art improvements to electronics design processes and CAD methodologies, rather than on the functions of the individual tools themselves.
Of interest to 2.5D and 3D enthusiasts, this year Herb Reiter will give a 3D-IC update to briefly explain the need for the rapidly emerging interposer- based (a.k.a. 2.5D ) designs and 3D-ICs. He will outline 3D-IC specific additions to a typical SoC design flow, then summarize which 2.5/3D-specific capabilities and benefits major EDA vendors’ tools and flows currently offer to enable design and manufacturing of cost-effective and reliable 2.5D and 3D configurations.
