The 67th annual Electronics Component Technology Conference (ECTC 2017) takes place May 30 – June 2, 2017 at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA. This premier international conference, sponsored by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society, covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.
The ECTC Program Committee, with more than 200 experts from a range of technical areas, is committed to creating an engaging technical program for all. ECTC typically attracts more than 1,300 attendees from over 25 countries. The 67th ECTC will continue the tradition of being the premium venue to showcase all the latest developments in the electronic components industry, in which advanced packaging has become a way to achieve device and system performance scaling.
This year’s program includes six parallel technical sessions over three days, along with other special topic panel discussions to present high-level trends and best practices in the industry. Professional Development Courses (PDCs) will also be offered by world-class experts, enabling participants to broaden their technical knowledge base.
The technical program and PDCs are supplemented by Technology Corner Exhibits, which provide an opportunity for leading companies in the electronic components, materials, and packaging fields to exhibit their latest technologies and products. For more information, visit the ECTC 2017 website.