The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
For more info visit: http://www.imaps.org/devicepackaging/
 Courtesy of Amkor Technology | The Largest 2020 Conference Dedicated to… 3D Integration; Fan-Out, Wafer Level Packaging  Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications |
