03/02/2020 - 03/05/2020 -12:00 am

Location: WekoPa Resort

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The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

For more info visit: http://www.imaps.org/devicepackaging/

Courtesy of Amkor Technology

The Largest 2020 Conference Dedicated to…

3D Integration;

Fan-Out, Wafer Level Packaging
& Flip Chip;

Advanced Packaging and Emerging Materials for Automotive, 5G, and Next Gen Applications