06/26/2017 - 06/27/2017 -9:00 am - 5:30 pm

Location: MINATEC

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Come to the 9th annual Workshop on Design for 3D Silicon Integration (D43D)  in Minatec, France on June 26-27, 2017. This year the D43D workshop will be held in conjunction with  Leti Days, during the 50th anniversary of CEA-LETI. Also for the first time, the D43D workshop will share the technical program with the Leti Memory Workshop (LMW), with two common sessions on 3D Memory devices.

The D43D workshop is a two-day forum that brings together experts from both industry and academia to shed light on these near-term to long-term challenges and solutions and covers topics including, but not limited to : 3D technology, including the recent upcoming Monolithic 3D technology (CoolCubeTM), co-integration of 3D technology and recent 3D memory NVM devices, 3D Architecture for Computing, interconnect architectures, thermal management, 3D for photonic, 3D for imaging applications, design methodologies and tools, reliability and testing. The objective is to bring experts from both industry and academia to share recent results on the latest and most advanced 3D technologies. 

Workshop Technical Program 

The two-day program includes: 

  • 3D Memory Devices
  • 3D Emerging Memories and New Architecture Paradigm
  •  3D Technology Landscape and Advanced Imagers
  • 3D for High-Performance Computing
  • Monolithic 3D: from Technology to Advanced Design 
  • 3D Design and Tools

The presentations will cover the full range of 3D topics, with two overview talks from YOLE and KNOWMADE, from prestigious universities (Univ. of Stanford, Georgia Institute of Technology, Univ. of Utah, Boston Univ., LIRMM, Univ. of Manchester, Univ. of Kaiserslautern), to recent advances in 3D within the industry (STMicroelectronics, ARM, IBM, Mentor Graphics, Monozukiri), and with recent outcomes from research institutes (Fraunhofer, CEA-LETI).

 For the detailed technical program, please check the www.d43d.com website.  Click for workshop registration.