Wednesday, July 1, 2020 | 12:00pm – 12:45pm EASTERN | Webex
Andy Heinig has been working at Fraunhofer since 2007. Currently, he is the head of the department efficient electronics. In this position, he leads national and international research projects in the field of advanced packaging and 2.5, 3D-integrated circuits. His research interests concern layout automation for 2.5/3D-integration of circuits, algorithms for pathfinding in 3D-systems and modelling of physical effects in the range of advanced packaging. Moreover, he acts as person responsible in different standardization organizations, e.g. the Si2 working group Chip-package-codesign.
Registration is FREE for IMAPS members and students.
Non-member registration is $50.
This webinar will be hosted via Webex. Registrants will receive an email prior to the start of the webinar with login instructions.