03/18/2022 -12:00 am

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Call-for-Paper : DATE 2022 Friday Workshop on “3D Integration: Heterogeneous 3D Architectures and Sensors”

Antwerp, Belgium,

Friday March 18, 2022


Workshop Committee

  1. Vivet – CEA-LIST (FR) – general co-chair
  2. Badaroglu – Qualcomm (BE) – general co-chair
  3. Ramm – Fraunhofer EMFT (GE) – program co-chair
  4. Mukhopadhyay – Georgia Tech (USA) – program co-chair
  5. Mitra – Stanford University (USA) – special session chair
  6. Ollier – CEA-LETI (FR) – Industrial liaison chair


The Design, Automation, and Test in Europe conference and exhibition is the main European event bringing together researchers, vendors and specialists in hardware and software design, test and manufacturing of electronic circuits and systems. Friday Workshops are dedicated to emerging research and application topics. At DATE 2022, one of the Friday Workshops is devoted to 3D Integration. This one-day event consists of a plenary keynote, invited talks, and regular presentations.

3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration. Due to the high amount of required data and associated memory capacity, Machine Learning and AI accelerator could benefit of 3D integration not only for High Performance Computing (HPC), but also for the edge and embedded HPC. 3D integration and associated architectures are opening a wide spectrum of system solutions, from chiplet-based partitioning for High Performance Computing to various sensors such as fully integrated image sensors embedding AI features, but also with the tight 3D coupling of computing & memory enabling efficient In-Memory-Computing paradigm.

The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.

Previous editions of this workshop took place regularly, in conjunction with early editions of DATE conferences.

Topic Areas

You are invited to participate and submit your contributions to the DATE 2022 Friday Workshop on

3D Integration. The areas of interest include (but are not limited to) the following topics:

  • 3D technologies: chiplet, interposer, through-silicon-vias, micro-bumping, hybrid-bonding, monolithic 3D
  • 2.5D/3D architectures and partitioning for logic, memory, IO, analog, RF and sensors
  • 3D Memory & Logic for High Performance Computing, Mobile Computing, and AI acceleration
  • Application, product, or test chip case studies
  • 3D design methods and EDA tools
  • Chip-package co-design for 3D
  • Signal and power integrity, and ESD in 3D
  • Thermo(-mechanical) analysis and -aware design
  • Fault Tolerance, Reliability, Safety, Security techniques for 3D architectures
  • Test, KGD/KGW methods, DFT, debug/FA for 3D
  • Economic benefit/cost trade-off studies
  • Standardization initiatives


Submissions are invited in the form of (extended) abstracts not exceeding two pages and must be submitted on easychair, on https://easychair.org/conferences?conf=date223dws

All submissions will be evaluated for selection with respect to their suitability for the workshop, originality, and technical soundness. Selected submissions will be accepted for long or short oral presentation. At the workshop, an Electronic Workshop Digest will be made available to all workshop participants, which will include all material that authors are willing to provide: abstract, paper, slides, poster, etc.


Paper Submission deadline                        November 29, 2021

Notification of Acceptance                         December 6, 2021

Camera-Ready Material due date             February 10, 2022