09/07/2022 - 09/08/2022 -12:00 am

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GE Research, IBM Research and IEEC-Binghamton University are proud to host the 33rd Annual Electronics Packaging Symposium

About this event

GE Research and IEEC-Binghamton University invite you to attend this two-day event on September 7 and 8, 2022 at Binghamton University in Vestal NY.

Our theme this year is The Connected World and the importance of understanding our Supply Chain

Our committed keynote speakers this year are:

Willy Shih – Harvard Business School

This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics of:

• Future of Computing for HPC and AI

• mm Wave, 5G and 6G in Packaging

• Power Electronics

• Thermal Challenges / Harsh Environments

• Flexible & Additive Electronics

• Heterogeneous Integration

• Advance Substrates

• Wearable and Flexible Electronics for Medical Applications

Agenda : https://www.binghamton.edu/ieec/eps/agenda.html

This year’s program includes keynotes, 8 sessions with technical presentations, a student poster session with students from local Universities in NY, and exhibits from leading companies.

A special panel will be held to discuss the state of the Electronics Industry Ecosystem in the US along with a Heterogeneous Integration Roadmap workshop to discuss the challenges that we will face in the coming years in advance packaging.

We aim to share quality, up-to-date information through different lenses on trending electronics packaging topics, and provide opportunities to network, share ones expertise, learn, and build partnerships.

We highly encourage graduate students to join us in the poster session to showcase their research! Make sure to register.


Registration , required forms and program details can be found on our website:

Contact us at: epsympos@binghamton.edu


REGISTER TODAY and join a community which seeks advancement in the electronics packaging field. We look forward to seeing you this fall.