Enjoy the latest sips and SiPs at the first System-in-Package (SiP) conference on June 27-29, 2017 in Sonoma, California. Join us as we discuss market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges.
Over the course of three days, attendees will sit in on technical sessions, panel discussions, exhibitors and local activities.
SiP 2017 will provide dynamic learning and technology updates for upcoming trends and new engineering innovations from the industry leaders.
The keynote presentations by Nozad Karim, James T. Fahey, and Dr. Hannes Voraberger. will discuss the past, present, and future of SiP, the evolution of electronic materials in the information age, and the package of the future: an all-in-one solution.
Attendees will also be treated to a special evening experience at the Benziger Family Winery in Sonoma, featuring a private tour, wine tasting, and dinner at one of the most popular wine estates in California’s famous wine region.
Register today and be a part of an event that will bring supply and design chain together under one roof.