The CPMT Society (Binghamton Chapter) continues its tradition of hosting a 2.5D & 3D Packaging Workshop in conjunction with the annual the Electronic Packaging Symposium. The 2015 Workshop will be held from 1:20 pm to 5:30 pm on September 16th, immediately following the Symposium, in the same meeting room. We have an outstanding slate of speakers from industry and academia addressing the great opportunities and important challenges of 2.5D & 3D Heterogeneous Packaging Integration. A single registration will cover both events. Plan to attend both.
Click HERE to Register. Registration ends September 7, 2015!
The two day program will include Keynote Lectures, Technical Presentations, Half-day Workshop on 2.5/3D Integration, and a Student Poster Session on topics including:
- 2.5D/3D Packaging
- Thermal Challenges
- Flexible, Printed, and Additive Electronics
- MEMS, Sensors, and Microfluidics
- Emerging Materials
- Harsh Environment Electronics
- Energy Conversion and Storage
- Embedded Electronics
Electronic Packaging Symposium agenda is available HERE CPMT 2.5D & 3D Workshop Agenda is available HERE