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Advanced Packaging at SEMICON West

Advanced Packaging at SEMICON West

Generation Mobile, “Thin is In” and More Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function. To address these massive changes, SEMICON West will feature a number of programs on new packaging technologies and processes with speakers from leading chip makers, equipment manufacture... »

3D IC Business Model: A Customer Decision

3D IC Business Model: A Customer Decision

After more than a year of touting the turnkey model, even TSMC is jumping on board the collaboration bandwagon for manufacturing 2.5D and 3D ICs at high volume. This revelation came this week at ECTC 2013 (May 28-31, Las Vegas) from TSMC’s Jerry Tzou, who was a panelist during the special session, “The Role of Wafer Foundries in Next –Gen Packaging.” Chaired by Sam Karikalan, Broadcom, the... »

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first annual 3D InCites Awards. All proceeds of the a... »

Catching up with EV Group’s Dave Kirsch

Catching up with EV Group’s Dave Kirsch

Almost a year ago, Dave Kirsch took over the reins from Steve Dwyer as VP and General Manager of EV Group North America. Since EV Group launched a tool last week at SEMICON Singapore, and since EVG NA’s headquarters are practically in 3D InCites’ back yard, I thought it was time to check in and catch up with Kirsch to find out more about this tool launch, and the company’s activities in the ... »

tablets and smartphone

Reinventing the PC; MEMS and LEDs Grow Up

The PC world is dead?  Chris Hubbard, Intel’s Business PC Marketing Manager scoffs at the mere idea. “The demise of the PC industry was predicted before it was born!” he said during his opening presentation at the SEMI Americas Arizona Breakfast Forum, Friday April 12, 2013 at Intel in Chandler, AZ. Hubbard showed a chart contrasting PC revenue growth with different times over the years whe... »

Talking Points: Interconnectology, Inspiring a Paradigm Shift

Talking Points: Interconnectology, Inspiring a Paradigm Shift

At the BiTS Workshop 2013, the talk show segment, Talking Points, examined the concept of Interconnectology and how adopting new terminology can inspire a paradigm shift in the design and development of next-generation interconnect technologies, thereby impacting the semiconductor device manufacturing value chain. Hosted by Françoise von Trapp, 3D InCites, special guests included Scott Jewler, AN... »

The Hills are alive – in the Hill Country – The Interposer workshop in Austin

The Hills are alive – in the Hill Country – The Interposer workshop in Austin

Did anyone miss the Sound of Music bit during the Oscars? Anyway, with the sounds of “The Hills are alive..” in my head, I drove off the next day down to the Hill Country in Austin to the invitation-only, On The Road to Fine Feature IC Package Substrates and Interposers Workshop, hosted by Jan Vardaman of TechSearch International. This is a nice, comfortable-sized venue with approximately 100 ... »

2013 Predictions for 3D ICs as told by Everyone – Part 2

2013 Predictions for 3D ICs as told by Everyone – Part 2

No sooner did I post last week’s curation of predictions for the semiconductor industry, and particularly for 3D ICs, than several more popped up online. I suspect this type of thing to continue for the next few weeks, and I will try and continue to cherry-pick the ones that made reference to 3D integration. In a Semiconductor Packaging News Viewpoint, Doug Goodman, CEO, Ridgetop Group, Inc. tal... »

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