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SavanSys Solutions: 2.5D & 3D Packaging Cost Model

SavanSys Solutions: 2.5D & 3D Packaging Cost Model

Product Description The 2.5D & 3D Packaging Cost Model is the first tool available to model the total cost and yield from fabrication of the wafers to complete assembly. The user is able to edit a variety of parameters, including TSV and interposer characteristics and die preparation details, and generate a detailed cost breakdown. Testimonial Over the last few years, a number of foundries and... »

Apache Design: RedHawk-3DX

Apache Design: RedHawk-3DX

Product Description Apache Design’s fourth-generation RedHawk™-3DX simulation software technology extends previous generations’ capabilities to address sub-20 nanometer (nm) designs with 3+ gigahertz performance and billions of gates. It is also architected to support the simulation of emerging chip and packaging technologies using multi-die three-dimensional ICs (3D-ICs) for smart electroni... »

Metryx: Mentor Mass Metrology Tool

Metryx: Mentor Mass Metrology Tool

Product Description Mass metrology is the measurement of the mass change on a wafer as a result of a wafer processing step. Mass metrology enables inline measurement on product wafers, enabling an increase in test coverage with high throughput. Mass as an SPC response has been adopted by 200mm and 300mm volume wafer manufacturers for advanced technology nodes. Testimonial As the 3D–stacking of I... »

Mentor Graphics: Calibre

Mentor Graphics: Calibre

Product Description Calibre enables signoff verification of chip stacks with flip chips, silicon interposers and through-silicon vias (TSVs). Verification of individual dies is followed by checks on the interfaces between dies, including dimensional checks (bump alignment and rotation), connectivity checks (LVS), and parasitic extraction (PEX) using a special 3D-IC rule file. Testimonial Calibre a... »

Triton Micro Technologies: Through-glass-via (TGV) interposer

Triton Micro Technologies: Through-glass-via (TGV) interposer

Product Description Triton Micro Technologies’ ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC packaging. Triton uses micro-drilling and via-fill technologies to manufacture 2.5D and 3D TGV interposers for MEMs, RF and optics applications on wafers up to 300mm with thicknesses of 0.7mm and below. Testimonial The global semiconduc... »

Multitest: InStrip3D

Multitest: InStrip3D

Product Description The InStrip3D utilizes the experience gained from a well-established installed base of high-parallel InStrip/InMEMS solutions. The architecture of the InStrip allows the configuration of the system to meet the special requirements of partial stack test with respect to the extremely sensitive bare dies. Testimonial Multitest is the first equipment supplier to deliver a full turn... »

Rudolph Technologies: NSX 320 Metrology Series

Rudolph Technologies: NSX 320 Metrology Series

Product Description The NSX 320 Metrology Series combines macro inspection and 3D metrology for advanced packaging applications. The demonstrated 3D measurement capability from Tamar Technology is now incorporated onto the industry standard NSX Macro Inspection System to offer a complete 2D/3D inspection and metrology solution for unique advanced packaging process requirements. Testimonial Process... »

ALLVIA: Silicon Interposers for Electro-Optical Engines

ALLVIA: Silicon Interposers for Electro-Optical Engines

Product Description 2.5D Silicon Interposers form the base for the assembly of electro-optic engines for Chip-to-World Interconnects. These electro-optic engines with TSVs, the foundation for so-called “active cables”, offer outstanding Interconnect Bandwidth Density. They operate at 10 Gb/s today and are expected to migrate to 25 Gb/s or higher in the nearest future. Testimonial The higher op... »

SSEC: 3300 Series for TSV Clean

SSEC: 3300 Series for TSV Clean

Product Description: Post DRIE etch TSV cleaning is essential to the reliability of 2.5D and 3D IC devices. SSEC’s proprietary soak and spray technology minimizes spray time and chemistry use for lower cost-of-ownership than conventional wet bench or single spray approaches; it achieved 100% photoresist and sidewall fluoropolymer removal 5x faster than spray only. Testimonial: Improved yields an... »

E-System Design: Sphinx 3D Path Finder

E-System Design: Sphinx 3D Path Finder

Product Description 3DPF is a full wave 3D path finding tool based on a patented, mesh-less algorithm for cylindrical objects (vias and bond wires).  By not meshing cylindrical objects, significant memory and CPU time is saved allowing users to analyze much larger structures in a much shorter time. Testimonial From Sherry Liu at Qualcomm: I started to use Sphinx 3D Path Finder (“3DPF”) V1.0 ... »

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