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SPTS: ReVia Endpoint System

SPTS: ReVia Endpoint System

Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes even at remarkably low (<0.01%) via densities. It is a unique solution that can significantly increase yields for device manufacturers involved in emerging 3D packaging applications utilizing through-silicon vias (TSVs). Testimonial Via reveal substrates typical... »

Ziptronix: Copper DBI Technology for 3D Memory Assemblies

Ziptronix: Copper DBI Technology for 3D Memory Assemblies

Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies in December 2012. Copper DBI® technology offers higher throughput and better scalability when compared to copper thermo-compression bonding. This technology can be incorporated into die-to-die, die-to-wafer and wafer-to-wafer processes. Testimonial “There is... »

SET North America: ONTOS7 Surface Preparation System

SET North America: ONTOS7 Surface Preparation System

Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric ambient prior to bonding.  Proven effective on many elemental metals and their alloys, this tool cleans and passivates bonding surfaces rapidly and safely without damaging critical layers. Testimonial To achieve high-density 3D IC, desi... »

Alchimer: eG3D Polymer

Alchimer: eG3D Polymer

Product Description Alchimer’s eG3D Polymer simplifies the metallization process flow for deposition processes for TSV insulation and barrier by combining the material properties of electrografting (eG) insulation and chemicalgrafting (cG) barrier technologies into a single step process. eG3D Polymer wet processes achieve favorable insulation and barrier properties at a reduced cost of ownership... »

Xilinx: Virtex-7 H580T

Xilinx: Virtex-7 H580T

Product Description The Virtex-7 H580T FPGA is the first 3D heterogeneous all programmable device, featuring up to eight 28 Gbps and 48 13.1 Gbps transceivers, making it the only single-chip solution to provide customers with the system integration to meet space, power and cost challenges of transitioning to 100G CFP2 optical modules. Testimonial As the world’s first 3D heterogeneous all program... »

Synopsys: Galaxy Implementation Platform

Synopsys: Galaxy Implementation Platform

Product Description Synopsys’ Galaxy™ Implementation Platform is the industry’s leading solution for IC implementation and signoff. Now available with powerful automation for multi-die implementation and foundry certified design flows, Galaxy provides a silicon-proven path to successful implementation of 3D-IC stacked die and silicon-interposer based 2.5D systems. Testimonial Following colla... »

Dow Corning: Temporary Bonding Solution

Dow Corning: Temporary Bonding Solution

Product Description Dow Corning temporary bonding solution is a bi-material silicone based technology featuring low cost of ownership and room temperature bonding and debonding. The chemical and thermally stable materials are spin-on type and can be use for wafer thinning down to 50um providing a global TTV of 2um on stack. Testimonial Walter Ganzevles, imec says “Dow Corning silicone-based mate... »

EV Group: EVG850TB/DB XT

EV Group: EVG850TB/DB XT

Product Description The EVG850TB/DB XT temporary bonding/debonding platform addresses the high volume manufacturing needs for thin wafer processing. Nine process modules combined with integrated FOUP storage system allow true continuous mode of operation with an unprecedented throughput of >40 bonds/debonds per hour. The EVG850TB/DB XT supports all common bonding adhesives and various debonding... »

Cielution: CielSpot, CielSpot-CTM, CielMech

Cielution: CielSpot, CielSpot-CTM, CielMech

Product Description CielSpot, CielSpot-CTM and CielMech are thermal and mechanical simulation Software As A Service (SAAS) products based on Cielution’s innovative Cloud based collaboration platform. Users define 3D IC stacking, process and power distribution details at the Cielution online portal to implement complex, but necessary design methodologies with minimal effort. Testimonial “I ... »

Cadence Design Systems: Encounter Test

Cadence Design Systems: Encounter Test

Product Description Cadence Encounter Test provides a comprehensive methodology for 3D-IC design-for-test and automatic test pattern generation that includes a DfT architecture that controls and observes an individual die from the chip I/Os, different test modes to control application of tests up and down the stack, and interconnect tests to detect through-silicon via defects. Testimonial This pro... »

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