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SSEC: WaferEtch TSV Revealer

SSEC: WaferEtch TSV Revealer

SSEC’s WaferEtch™ TSV Revealer is a single wafer wet processing platform for 3D IC and interposer wet etching applications designed to reduce processing and capital equipment costs. The WaferEtch features superior uniformity of silicon thickness (as low as -/+ 0.7%). Testimonial Via reveal is a critical process step in 2.5D and 3D IC technologies that involves thinning the backside of the wafe... »

Lasertec: BGM300

Lasertec: BGM300

The BGM300 was designed to enable quick and accurate measurement of Through Si Via (TSV) depths, Si wafer thickness, and Remaining Si Thickness (RST) above TSVs – all essential in a managed backside via reveal process flow. Back grinding errors due to “blind” grinding can lead to significant yield loss. Testimonial: During the back grinding process to reveal the TSV, it is extremely importan... »

Fogale: TMAP DUAL 3D 300 A

Fogale: TMAP DUAL 3D 300 A

The TMAP DUAL 3D 300 A is a unique metrology and inspection tool available to the semiconductor industry capable of addressing all customer measurement requirements for MEMS and 3D packaging. The TMAP is highly flexible, accurate, and repeatable. The heart of this tool is based on multi-sensor heads which include different technologies in the same integrated tool. As an example, double IR microsco... »

NORDSON Dage: XM8000 Wafer X-ray Metrology Platform

NORDSON Dage: XM8000 Wafer X-ray Metrology Platform

Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in wafers and 2.5D/3D IC packages. Available measurements include voiding, via fill, overlay and critical dimensions in TSVs, wafer bumps and MEMS. Testimonial: The XM8000 Wafer Metrology Platform provides a new and unique X-ray metrology platform for fast, automat... »

Rudolph Technologies: JetStep S Series Lithography System

Rudolph Technologies: JetStep S Series Lithography System

As advanced packaging facilities transition their manufacturing from round wafers to square panels, the JetStep S Series Lithography System is fully capable of handling panels up to Gen 3.5 (720x650mm). The system offers high throughput through a large printable exposure and increased productivity through on-the-fly autofocus for thick photoresists. Testimonial Moving from round wafers to rectangu... »

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

EV Group Celebrates Strong Growth and New Manufacturing Process Solutions at SEMICON West 2013

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SEMICON WEST, San Francisco, July 9, 2013— EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expan... »

FormFactor: NanoPierce Contactor

FormFactor: NanoPierce Contactor

Product Description FormFactor’s NanoPierce™ contactor is a socket solution for direct testing of TSVs and micro-bump arrays for 3D IC integration. A disruptive test technology designed specifically for TSV applications, it is being used by semiconductor manufacturers in their TSV development programs. The technology was honored earlier this year at the IEEE VLSI Test Symposium in Berkeley whe... »

Cascade Microtech: CM300 Probe System

Cascade Microtech: CM300 Probe System

Product Description Cascade Microtech’s 3D probing solution, comprising the CM300 probe station and Pyramid Probe® cards with RBI technology, captures the true electrical performance of devices and helps produce high-integrity data. The CM300 achieves hands-off productivity to probe 3D stacked devices, using PTPA to successfully probe 25µm diameter micro-bumps. Testimonial Wafer probing is... »

Dynaloy, LLC: CoatsClean

Dynaloy, LLC: CoatsClean

Product Description CoatsClean ER105 is a wet resist and residue remover that has been successfully used to remove post-Bosch and post-RIE etch residue created in the formation of TSVs. It offers good process margin, allowing it to be incorporated into both spray and immersion, singe wafer and batch-type process. Testimonial Photoresist and residue removal in post TSV wet cleans in 3D packaging ap... »

SPTS: ReVia Endpoint System

SPTS: ReVia Endpoint System

Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes even at remarkably low (<0.01%) via densities. It is a unique solution that can significantly increase yields for device manufacturers involved in emerging 3D packaging applications utilizing through-silicon vias (TSVs). Testimonial Via reveal substrates typical... »

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