Market Research

Mobile Sector Dominates the Advanced Packaging Market as IoT Looms on the Horizon

Mobile Sector Dominates the Advanced Packaging Market as IoT Looms on the Horizon

“Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020,” announces Yole Développement (Yole). Overall, the main advanced packaging market is the mobile sector with end products such as smartphones and tablets. Other high volume applications include servers, PC, game stations, external HDD/USB and more… According to Yole’s latest advanced packaging... »

Flip Chip Technology: Which Companies will Invest to Support Growth?

Flip Chip Technology: Which Companies will Invest to Support Growth?

Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS Image Sensors (CIS) applications, the flip chip market is expanding. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and bumping houses are entering this market. The “More than Moore” market research ... »

High Performance Requirements are Driving the Graphics Market

High Performance Requirements are Driving the Graphics Market

Last June, AMD released a new generation of graphics card, Radeon™ R9 Fury X, dedicated to PC gaming applications and including High-Bandwidth Memories (HBM). The “More than Moore” market research and strategy consulting company, Yole Développement (Yole) announces a complete 3D & 2.5D packaging analysis & costing report focused on the HBM integrated on chip led by AMD and its partn... »

System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies

System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies

The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report, Yole Développement, Aug. 2015). With every new model, smartphone manufacturers are trying to bring users a better experience, incredible functions, innovative design and new applications. But how are they manufacturing it? What are the real innovations at the device and mod... »

Disruptive Impact of FO-WLP Growth Coming for Electronics Industry

Disruptive Impact of FO-WLP Growth Coming for Electronics Industry

Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in the coming years. WLP has seen strong growth, especially in the mobile devices, because it provides a low-profile package that meets the requirements of many smartphone makers. Billions of WLPs are shipped each year and FO-WLP adoption will drive the number even high... »

Improving R&D Efficiency to get “Moore” out of Chips

Improving R&D Efficiency to get “Moore” out of Chips

The semiconductor industry invests more in R&D than any other industry except pharmaceuticals. At the same time, It is dealing with shortening product life cycles. How is the industry expected to continue innovating while still profiting from their R&D investments needed to deliver transitions in main areas such as lithography and wafer sizes? While the microelectronics industry could use ... »

Market Outlook for Permanent Wafer Bonding

Market Outlook for Permanent Wafer Bonding

Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesive bonding, or metallic bonding including Cu-Cu/oxide “hybrid” bonding, solder bonding, and thermo-compression copper-copper bonding as shown in Figure 1. MEMS devices are the main applications us... »

Page 2 of 212