Market Research

System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies

System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies

The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report, Yole Développement, Aug. 2015). With every new model, smartphone manufacturers are trying to bring users a better experience, incredible functions, innovative design and new applications. But how are they manufacturing it? What are the real innovations at the device and mod... »

Disruptive Impact of FO-WLP Growth Coming for Electronics Industry

Disruptive Impact of FO-WLP Growth Coming for Electronics Industry

Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in the coming years. WLP has seen strong growth, especially in the mobile devices, because it provides a low-profile package that meets the requirements of many smartphone makers. Billions of WLPs are shipped each year and FO-WLP adoption will drive the number even high... »

Improving R&D Efficiency to get “Moore” out of Chips

Improving R&D Efficiency to get “Moore” out of Chips

The semiconductor industry invests more in R&D than any other industry except pharmaceuticals. At the same time, It is dealing with shortening product life cycles. How is the industry expected to continue innovating while still profiting from their R&D investments needed to deliver transitions in main areas such as lithography and wafer sizes? While the microelectronics industry could use ... »

Market Outlook for Permanent Wafer Bonding

Market Outlook for Permanent Wafer Bonding

Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesive bonding, or metallic bonding including Cu-Cu/oxide “hybrid” bonding, solder bonding, and thermo-compression copper-copper bonding as shown in Figure 1. MEMS devices are the main applications us... »

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