Historically, the integrated circuit (IC) substrate and board industry have assumed a passive role, especially when it comes to innovation. However, in the past few years, things have changed. The dedicated landscape welcomed innovative solutions and new players. “Today, we are facing an increasingly competitive ecosystem and players are looking to differentiate from each other’s” asserts Ma... »
Without a doubt, 5G has arrived and various key smartphone OEMs have already announced products that will support 5G cellular and connectivity. It is clear for everyone that 5G will totally redefine how the radio frequency (RF) front-end interacts in-between the network and the modem. The new RF bands (sub-6 GHz and mm-wave, as defined in 3GPP release 15) pose big challenges for the industry. The ... »
More than half of microelectromechanical systems MEMS packaging today is done by outsourced semiconductor and test services providers (OSATs) and Yole Développement (Yole) estimates OSATs’ market share will continue to grow in the next five years. The MEMS volume augmentation, especially for radio frequency (RF) applications, is making the MEMS business more and more attractive for OSATs, which... »
In the AMD-NVIDIA battle, System Plus Consulting’s experts continue to pursue innovation and monitor progress. At the beginning of the year, AMD was pleased to announce its forthcoming graphics processor unit (GPU) architecture, Vega. Presented at CES 2017 and commercially available mid-2017, AMD’s GPU has been meticulously analyzed by System Plus Consulting’s lab. And the answers are very i... »
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain true, announces Yole Développement (Yole). Will the fan-out market growth keep going? Who can challenge the leading semiconductor company, TSMC? Is panel technology coming? What will be the next killer application? Many important questions face the fan-out packaging indu... »
Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role in the semiconductor industry. It is today already implemented as a mature solution, in several market segments such as infrared (IR) cut filter for CMOS image sensor (CIS) technology, microfluidics devices and some actuators and sensors. Yole Développement (Yole) confirm... »
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16% CAGR[1] during this period. China has the world’s largest po... »
With the proliferation of mobile electronic products and the ongoing push for greater functionality in a smaller area, miniaturization has become a key word for system-in-package (SiP). SiP provides increased functionality in a subsystem that can be more cost-effectively assembled into a system. Miniaturization and other technology trends driving SiP market growth are covered in TechSearch Interna... »
Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for successful commercial development. So, when will the panel-level packaging industry take off? How will it evolve? “At Yole, we’ve identified five key packaging platforms that can be processed on a larger surface (rectangular/square),” asserts Amandine Pizzagalli, Technology... »
“Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020,” announces Yole Développement (Yole). Overall, the main advanced packaging market is the mobile sector with end products such as smartphones and tablets. Other high volume applications include servers, PC, game stations, external HDD/USB and more… According to Yole’s latest advanced packaging... »
Site Design By
Recent Comments