Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16% CAGR[1] during this period. China has the world’s largest po... »
With the proliferation of mobile electronic products and the ongoing push for greater functionality in a smaller area, miniaturization has become a key word for system-in-package (SiP). SiP provides increased functionality in a subsystem that can be more cost-effectively assembled into a system. Miniaturization and other technology trends driving SiP market growth are covered in TechSearch Interna... »
Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for successful commercial development. So, when will the panel-level packaging industry take off? How will it evolve? “At Yole, we’ve identified five key packaging platforms that can be processed on a larger surface (rectangular/square),” asserts Amandine Pizzagalli, Technology... »
“Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020,” announces Yole Développement (Yole). Overall, the main advanced packaging market is the mobile sector with end products such as smartphones and tablets. Other high volume applications include servers, PC, game stations, external HDD/USB and more… According to Yole’s latest advanced packaging... »
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS Image Sensors (CIS) applications, the flip chip market is expanding. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and bumping houses are entering this market. The “More than Moore” market research ... »
Last June, AMD released a new generation of graphics card, Radeon™ R9 Fury X, dedicated to PC gaming applications and including High-Bandwidth Memories (HBM). The “More than Moore” market research and strategy consulting company, Yole Développement (Yole) announces a complete 3D & 2.5D packaging analysis & costing report focused on the HBM integrated on chip led by AMD and its partn... »
The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report, Yole Développement, Aug. 2015). With every new model, smartphone manufacturers are trying to bring users a better experience, incredible functions, innovative design and new applications. But how are they manufacturing it? What are the real innovations at the device and mod... »
Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in the coming years. WLP has seen strong growth, especially in the mobile devices, because it provides a low-profile package that meets the requirements of many smartphone makers. Billions of WLPs are shipped each year and FO-WLP adoption will drive the number even high... »
The semiconductor industry invests more in R&D than any other industry except pharmaceuticals. At the same time, It is dealing with shortening product life cycles. How is the industry expected to continue innovating while still profiting from their R&D investments needed to deliver transitions in main areas such as lithography and wafer sizes? While the microelectronics industry could use ... »
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesive bonding, or metallic bonding including Cu-Cu/oxide “hybrid” bonding, solder bonding, and thermo-compression copper-copper bonding as shown in Figure 1. MEMS devices are the main applications us... »
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