Postings

Artificial Intelligence: A New Era of the Advanced Packaging Industry

Artificial Intelligence: A New Era of the Advanced Packaging Industry

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole Développement (Yole), part of Yole Group of Companies investigates the advanced packaging industry and takes a closer look at the AI impact on this market. “3D integration is clearly offering today unequaled performances suitin... »

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

Advanced Substrates; Key Enabler of Future Advanced Packaging Solutions

“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement (Yole). Indeed advanced substrates are critical in enabling future products and markets. To answer to technology evolution and market needs, Yole’s advanced packagi... »

Advanced Packaging Industry: What We Can Expect in 2017…

Advanced Packaging Industry: What We Can Expect in 2017…

2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.“And 2017 seems to be following the same path”, wrote Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole in an article posted on i-micronews.com. Year after year, the advanced packag... »

New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries

New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries

A*STAR Institute of Microelectronics and Leading Semiconductor Partners combine research and market expertise to address industry challenges Singapore, 24 June 2013 – A*STAR Institute of Microelectronics (IME) has launched the 2.5D Through-Silicon Interposer (TSI) Consortium to accelerate market adoption of TSI technology, which is driven by strong demands in computer infrastructure and consumer... »

SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs

SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a follow up purchase order for the latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM (Integrated Device Manufacturer). The customer, who  installed SUSS MicroTec tools in 2012, plans to enter into a pilot production wit... »

3D ICs News in Brief – Jan. 19-29

3D ICs News in Brief – Jan. 19-29

While there is still a lot to report about the European TSV Summit, I wanted to catch everyone up on some recent developments at companies that have come my way via press release; beginning with the most recent: STATS ChipPAC and UMC announced that they have demonstrated the world’s first TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration. The companies re... »

EV Group Completes Cleanroom Expansion, Opens New R&D Labs And Customer Training Center At Corporate Headquarters

EV Group (EVG) supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria. As part of the company's long-term growth strategy to address high-volume tool orders and speed time to market for its worldwide customer base, EV Group doubled its c... »

TechSearch Celebrates 25 Years; Seeds Scholarship for Women in Engineering

TechSearch International, Inc. announces that in celebration of its 25th anniversary the company partnered with IEEE Women in Engineering Committee (WIE) to establish a scholarship for women going into the field of engineering.  The scholarship, named the IEEE Frances B. Hugle Engineering Scholarship, honors the memory of the distinguished engineer for whom the fund is named.  Frances Hugle gra... »

Georgia Tech PRC Proposes Industry Consortium on on 3D ThinPack (THInPack)

Georgia Tech Packaging Research Center (GT-PRC), through an industry consortium of about ~15 semiconductor, package and supply-chain companies from US, Europe and Asia, has been pioneering ultra-miniaturized electronics by Embedded MEMS, Actives and Passives (EMAP) Technology with chip-last (CL) interconnections but with chip-first benefits to demonstrate ultra-miniaturized modules with digi... »

Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology

Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down (xFD)TM technology for thin and light notebooks, also known as UltrabooksTM, and tablet computers. Invensas’ novel solution delivers the memory capacity and performance of a small outline dual in-line memory modu... »

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