Postings

ESI bolsters its laser microengineering offerings

Electro Scientific Industries, Inc. announced that it has bolstered its technology offerings for both its 3D IC packaging and memory repair product applications. »

SEMI and Semi-Directory Launch Semiconductor Supplier Guide

SEMI and Semi-Directory team up to launch a comprehensive industry-wide supplier guide. »

SPP/SPTS ships 300mm DRIE tool to CEA-LETI

SPP Process Technology Systems (SPTS) and its parent company Sumitomo Precision Products Co., Ltd (SPP),developers of plasma process technologies for manufacturing micro-electro mechanical systems (MEMS) and advanced semiconductor devices, today announc »

6th annual IWLPC program set

The SMTA, in conjunction with Chip Scale Review magazine, is pleased to announce the program for our 6th Annual International Wafer-Level Packaging Conference (IWLPC). Full details on the technical sessions, panel discussions and special events can be found at: www.iwlpc.com. »

IWLPC to feature five half-day tutorials

The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference, held  October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California. The IWLPC tutorials are application oriented and structured to combine field experience with scientific research to solve everyday problems. They are off... »

Alchimer introduces seedless wet deposition; eliminates entire step from TSV stacking

Alchimer S.A.,provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), announced a groundbreaking advance in TSV formation that eliminates one of the traditional metallization steps. »

Page 17 of 17«151617