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Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

· Sustainable technological cooperation for the future of industrial wireless communication · Joint Proof of Concept in a real industrial environment using the 3.7-3.8 GHz band · Researching the capabilities of 5G standalone networks for industrial applications Siemens and Qualcomm Technologies, Inc. have implemented the first private 5G standalone (SA) network in a real industrial environment ... »

Cu-Interposer Drives Connectivity to the Next Level

Cu-Interposer Drives Connectivity to the Next Level

Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019. The progressive miniaturization, increasing integration density, and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for ef... »

SEMI, Partners Launch Largest Microelectronics Education Initiative

SEMI, Partners Launch Largest Microelectronics Education Initiative

SEMI and 19 partners from 14 countries today launched a microelectronics education initiative to fill the skills gap and boost workforce diversity by tightening collaboration between the microelectronics industry and education providers. The project, dubbed METIS – Microelectronics Training, Industry and Skills – will focus on the skills and related training needed to support emerging vertical... »

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced wafer bonding solutions will be highlighted in several papers being presented at the 2019 IEEE 69th Electronic Components and Technology Conference (... »

TechSearch International Explores Power Device Packaging and Assembly Trends

TechSearch International Explores Power Device Packaging and Assembly Trends

Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments from 2017 to 2021 for power device packaging, with stronger growth projected for Cu clip packages. Applications including energy generation and infrastructure, electric and hybrid vehicles, electric vehicle charging, data centers, indu... »

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all-new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use la... »

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications

Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, to bring high-performance GaN-on-Silicon (GaN-on-Si) monolithic microLED technology to the mass market. microLEDs are the key optical technology for nex... »

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that IHP – Innovations for High-Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication, has purchased an EVG® ... »

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

Trymax Turns 15 and Celebrates Success at SEMICON Europa 2018

NIJMEGEN, THE NETHERLANDS – November 08, 2018. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, has reached a milestone this month celebrating 15 years of business. As a testimonial of its success, the company recently won the entrepreneurial prize from the Dutch financial institution FD Gazellen(1). “We have come a long way s... »

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafers. The company plans to ship multiple systems totaling more than $3M by year end to fill existing orders from two customers. The new system is the result of a multi-year collaboration with bare wafer ... »

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