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StratEdge Semiconductor Packages at IMS: Powering the Future of Technology
Jun 07, 2023 · By StratEdge · Press Releases
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Latest Posts - Page 31
Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line
Flanders, New Jersey —Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed... Presto Engineering Expands Turnkey IC Production Management Services with Three New Operations in Asia
San Jose, Calif., USA – Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, announced...
SET joins IRT Nanoelec 3D Integration Program
SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders,...
Advanced Packaging Industry: What’s New on the Market?
The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on...
Panel-level Packaging: a Promising Market
For many years now, the semiconductor industry development has been governed by Moore’s law and the increasing demand for higher...
SEMI Foundation Appoints Leslie Tugman as Executive Director
SEMI Foundation, a nonprofit affiliate of SEMI established to support education and career awareness in the field of high-tech, has... Invensas Licenses BVA Vertical Interconnect Technology to Tong Hsing for MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that Tong Hsing Electronic Industries Ltd., a leading Taiwanese provider...
Flip Chip Technology: Which Companies will Invest to Support Growth?
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip...
High Performance Requirements are Driving the Graphics Market
Last June, AMD released a new generation of graphics card, Radeon™ R9 Fury X, dedicated to PC gaming applications and...
System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies
The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report,...
Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating Chemistry
MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today... Disruptive Impact of FO-WLP Growth Coming for Electronics Industry
Fan-out wafer level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry in... Rudolph’s Yield Management System Software Expands Adoption in Advanced Packaging
Flanders, New Jersey (November 2, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received a multi-fab order for its... Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions
SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and... Photolithography Equipment & Materials Market Attracts New Players; Success Not Guaranteed
“Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex... Business Opportunities in Advanced Packaging Drive Photolithography Equipment Demand
Within the photolithography equipment market reaching US$ 150M 2014 (Source: Photolithography Equipment & Materials for Advanced Packaging, MEMS and LED... The More-than-Moore Supply Chain Dream has Become a Reality
The “More than Moore” revolution has already happened. Semiconductor manufacturing processes are no longer exclusive to the integrated circuit (IC)... The Semiconductor Industry: The Mastery of Time and Volumes
Since the dawn of the industry, semiconductor companies have developed disruptive technologies and solutions that have met the most ambitious... Rudolph Acquires Inspection Technology of Stella Alliance, LLC
Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a...