CEA and Siemens Collaborate on Research to Expand Applications of Digital Twin for Industry
Oct 03, 2023 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 29
TechSearch International Analyzes Trends in Packages for AI Applications
Artificial Intelligence (AI) combines both hardware and software. TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found...
Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies
SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading...
Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems
PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading...
New Defect Inspection Systems Address Process and Tool Monitoring Challenges
MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in...
Latest Abatement System Installation Marks a Milestone of Success for Edwards
SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000...
EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
TechSearch International Analyzes Potential for 3D Sensing Modules
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection,... TechSearch International Analyzes Trends in FO-WLP including Panel Activity
While Apple remains the main customer for TSMC’s Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a...
EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
The Advanced Packaging Industry is on the Move
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts...
EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets
Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening...
EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... Kamel Ait-Mahiout Appointed as CEO of UnitySC
Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and... UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control
Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired... Apple selected substrate-like PCBs for its latest iPhones. Who’s next?
The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are... EV Group and IBM Sign License Agreement on Laser Debonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and... MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production
North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and... TechSearch International Analysis Shows Packaging for Cryptocurrency Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip... 