Siemens Collaborates with TSMC on Design Tool Certifications
Apr 24, 2024 · By Siemens Digital Industries Software · Press Releases
Latest Posts - Page 22
Atotech’s New Generation of Zirconium-based Cleaner Coaters Provide Efficiency and Sustainability in a Single Step
UniCoat®, the ideal solution for applicators producing a wide variety of painted components with wet paint or powder paint BERLIN,...TechSearch International’s Analysis Shows Shortage of FC-BGAs Substrates Persists
Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply. What’s driving the...
SurplusGLOBAL has moved to Semiconductor Equipment Cluster in Yongin-si
Contributing to the vitalization of the global semiconductor equipment ecosystem Expecting to attract more than 1,000 overseas customers annually as...
YES EcoCoat™ HVM to Help Customer Fulfill Large NIH Contract for Rapid COVID Antibody Testing Devices
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,... Don Foldenauer Joins YES as Vice President of Operations
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,...
Micross Expands Capabilities with the Acquisition of Microelectronics Business Assets of Ultra CEMS
Melville, NY (July 7, 2021) – Micross Components, Inc. (“Micross”), a leading global provider of mission-critical microelectronic components and services...
Semiconductor Equipment Forecast to Post Industry High of $100 Billion in 2022, SEMI Reports
MILPITAS, Calif. — July 13, 2021 — Global sales of semiconductor manufacturing equipment by original equipment manufacturers are forecast to surpass... Prabhat Mishra Promoted to Vice President of Finance at YES
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications,...
What’s in the Apple Watch Series 6?
TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules...
Micross Components Acquires Semi Dice
Melville, NY (July 1, 2021) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for...
Smoltek Granted Three New Patents
Smoltek has been granted three new patents since the start of the year. The patents are related to three different...
Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame
Posthumous Recognition for Their Significant, Noteworthy Contributions to the Electronic System Design Industry Jim Hogan, executive, angel investor, and board...
Post Dispatch Names Brewer Science, Inc. a Winner of the Greater St.Louis Top Workplaces 2021
Seven Years Running for Top Workplace Recognition Rolla, Mo. – June 22, 2021– Brewer Science, Inc. (BSI) has been awarded...
EV Group Launches First-of-its-Kind Step-and-Repeat Mastering Services for Nanoimprint Lithography
EVG S&R Mastering Shop™ further lowers barriers to adoption of nanoimprint lithography for wafer-level and panel-level production applications such as...
Dedicated High‑Volume Advanced Packaging Facility, First in US, Announced by NHanced Semiconductors
AP foundry production to increase by 20x in 2022 NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry... Yield Engineering Systems, Inc. (YES) Joins Silicon Saxony High-Tech Network
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications,...
SEMI Urges U.S. and European Union Cooperation on Technology and Trade
MILPITAS, Calif. ─ June 14, 2021 ─ SEMI, the global industry association representing more than 2,400 semiconductor and electronics manufacturing companies worldwide, today...
StratEdge High-performance Semiconductor Packages to be on Display at IMS2021 Booth 1014
Santee, Calif. — June 7, 2021 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for...
EV Group Unlocks Agile and Efficient Production Scaling with Next-Generation Step-and-Repeat Nanoimprint Lithography System
EVG®770 NT enables large-area master stamp fabrication of complex micro- and nano-structures for augmented reality waveguides, wafer-level optics and advanced...
