featured

Sitaram Arkalgud: Going the Distance with 3D ICs

Sitaram Arkalgud: Going the Distance with 3D ICs

Since the early days of 3D InCites, as a member of our technical advisory board, Sitaram Arkulgud has been one of my go-to guys when I had a question about various 3D processes and technologies. There are few people in this industry that have been as enthusiastically optimistic as I am that 3D ICs will be commercialized; and Arkalgud actually knows what he’s talking about. As director of Interco... »

3D IC Gets a Nod or Two of Encouragement at Common Platform Tech Forum 2013

3D IC Gets a Nod or Two of Encouragement at Common Platform Tech Forum 2013

Guest Blogger, Paul Werbaneth, shares his take-aways on 3D ICs at the last week’s Common Technology Platform There was little advance promotion of 3D IC topics at the well-promoted Common Platform Tech Forum 2013 event, held this year at the Santa Clara (CA) Convention Center on Tuesday 05 February 2013, but I figured that, just like Gary Larson’s famous dog Ginger, my selective hearing on... »

Proof that the  Collaboration Model Works for 3D ICS

Proof that the Collaboration Model Works for 3D ICS

For the past year or so at various conferences, symposiums and summits focused on 2.5D and 3DIC technologies; we’ve been hearing suggestions about business model scenarios. It’s boiled down to three distinct choices. First is a ‘single integration’ model where end-to-end manufacturing takes place in one location – most likely a foundry or IDM. To date, the only foundry in the position to... »

3D TSV Summiit

European 3D TSV Summit: Focus on Cost of Ownership

Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned to optimizing them for improved cost of ownership (CoO).  At last week’s European 3D TSV Summit, in Grenoble, France, many of the supplier presentations demonstrated how their companies have been working to optimize qualified 3D TSV technologies across the process flow... »

3D TSV Summiit

European 3D TSV Summit: 3D TSVs Come of Age

Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European 3D TSV Summit. It was such a whirlwind few days, jam-packed with quality presentations demonstrating recent progress in all things TSV by the semiconductor manufacturing community and fabulous meals with industry colleagues and friends that this flight home is the first time I’ve... »

Image Courtesy of brightsideofnews.com

Inside the Gadgets at CES 2013

One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show, I’ve always just followed what other editors reported. But this year after flipping around the video of Qualcomm’s Paul Jacobs’ keynote address, I kind of felt like I missed out on something. One thing is for sure, while Jacob’s assumed a certain level of tech savvyness from the audi... »

More Tech Notes from 3D ASIP 2012

More Tech Notes from 3D ASIP 2012

Oh yes, where was I before the holidays took over and hijacked my life for two weeks?  I’ll bet you thought I was done reporting on 3D ASIP, but wait – there’s more! Point/Counterpoint on Thin Wafer Handling I already reported on Wilfried Bair’s (Suss MicroTec’s perspective on temporary/ debond bonding here. EV Group has also been working to overcome the thin wafer handling hurdles... »

Juergen Wolf, Fraunhofer IZM-ASSID

Fraunhofer IZM Update with M. Juergen Wolf

I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in the European 3D TSV Summit before the event takes place. So far I’ve checked imec and Leti off the list. Last week, I finally was able to achieve the trifecta when Juergen Wolf of Fraunhofer IZM had time to sit down during the 3D Architectures for Systems Integrat... »

3D ASIP 2012: Damn the Torpedos! Full Speed Ahead!

3D ASIP 2012: Damn the Torpedos! Full Speed Ahead!

After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear that there’s probably the same chance of 3DIC NOT happening, as there is a chance the world will end on Dec 21. (And oh by the way, Tom Pawlowski, chief technologist and fellow, Micron Technology, says he’s having a Day After the End of ... »

ACM Research team at 3D ASIP 2012.

ACM Research: New Kid on the 3D Block

Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an up close and personal tutorial preview by David Wang, CEO of ACM Research, on the tool manufacturer’s latest process solution for two critical points in the TSV fabrication process. The first is a TSV clean process that puts a new twist on existing conc... »

Page 29 of 29«272829