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The devil we know vs. the devil we don’t know

I keep reading about the various ways chip designers can achieve the performance/power benefits required for next generation mobile devices, and it always come down to two choices; continue traditional CMOS scaling or 3D die stacks. While there are issues with each, it seems that for the designer, the decision...

Talkers vs. Doers in the 3D IC World

Are there still people who are clueless about 3D? Apparently there are. Lots of them. Despite all the discussion and attention 3D integration gets on the conference circuit and through media outlets such as 3D InCites, there are still IC design and process engineers working in semiconductor manufacturing who are still unaware...

Solving Wireless Challenges at IMAPS

The irony of the week: Qualcomm, leader of the wireless world, sends a large contingency to participate in and sponsor IMAPS 2012, taking place at the Town and Country Resort and Convention Center in San Diego (I use the term “resort” very loosely), and the wireless was crap (really, I...

The Up and Coming Flavors of 3D Memory

Up until recently, I really hadn’t paid much attention to the the intricacies of memory types required to satisfy the plethora of computing needs from today’s PCs to tomorrow’s data centers and mobile devices. I had a general understanding of caches and main memory, and the increasing need for shorter...

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