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Catching up with imec’s Eric Beyne

Eric Beyne (imec) and I go way back. He’s the Scientific Director of Advanced Packaging Technologies at imec, and ever since my Advanced Packaging days, he’s been a valuable resource whenever I have technology questions about any part of the spectrum of 3D integration technologies. Basically, I can count on...

A Plethora of 3D Memories

Because 3D Memory really stands out as an industry apart from 3D ICs, I’ve been collecting some interesting articles over the past few weeks, with the intention of bringing 3D InCites a curated update.  Here it is.  In the wake of JEDEC’s announcement that it had released its specification for...

How do you use your mobile devices?

Over the summer, we became a 3 iPad household; my daughters because they were headed off to college and iPads are suddenly the must-have item for note-taking and homework doing; and me because I decided I was really tired of schlepping a laptop with an old battery to conferences, searching...

The devil we know vs. the devil we don’t know

I keep reading about the various ways chip designers can achieve the performance/power benefits required for next generation mobile devices, and it always come down to two choices; continue traditional CMOS scaling or 3D die stacks. While there are issues with each, it seems that for the designer, the decision...

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