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3D IC Blogosphere Update

After wrapping up a run of blog posts from two weeks of travel and 4 conferences,(IWLPC 2012, the IEEE 3D Test Workshop, and MEPTEC’s co-located Roadmaps to Multi-die Integration and Known Good Die Symposium) it’s time to catch my breath and see what else has been going on in the...

Coffee Break with Nicolas Sillon, CEA Leti

The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a one-on–one discussion about Leti’s accomplishments and position in the 3D space, and the upcoming European 3D TSV Summit, which takes place in Grenoble, January 22 & 23. Sillon has served...

IWLPC 3D Thursday: The Panel

It’s been a whirlwind of conferences these past few weeks, and as a result, I have attended FOUR panel discussions on 2.5D and 3D related topics. (I already wrote about the 3D Test Workshop Panel – 3D Buzz Hype or Reality. It’s stirred quite a discussion.) The day before I...

3D ICs and the Hype Cycle

At last week’s 3D Test Workshop in Anaheim, CA, I had the pleasure of moderating a panel of industry experts, analysts and bloggers, with a topic focused on 3D ICs, Hype vs. Reality? Jan Vardaman (TechSearch International), Herb Reiter (eda2asic) Paul Werbaneth (executive marketing consultant) and Ira Feldman (Feldman Engineering)...

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