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Coffee Break with Nicolas Sillon, CEA Leti

The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a one-on–one discussion about Leti’s accomplishments and position in the 3D space, and the upcoming European 3D TSV Summit, which takes place in Grenoble, January 22 & 23. Sillon has served...

IWLPC 3D Thursday: The Panel

It’s been a whirlwind of conferences these past few weeks, and as a result, I have attended FOUR panel discussions on 2.5D and 3D related topics. (I already wrote about the 3D Test Workshop Panel – 3D Buzz Hype or Reality. It’s stirred quite a discussion.) The day before I...

3D ICs and the Hype Cycle

At last week’s 3D Test Workshop in Anaheim, CA, I had the pleasure of moderating a panel of industry experts, analysts and bloggers, with a topic focused on 3D ICs, Hype vs. Reality? Jan Vardaman (TechSearch International), Herb Reiter (eda2asic) Paul Werbaneth (executive marketing consultant) and Ira Feldman (Feldman Engineering)...

IWLPC Dinner Keynote: Are Trojan Chips a “Dormant Curse?”

After listening to John Ellis, semiconductor industry veteran and author of the techno-thriller, The Dormant Curse, expound on the threat of Trojan chips in smartphones, I know what's next on my reading list. While I've never really been much for techno-thrillers (although I did read Stieg Larsson's Girl with the...

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