Blogs Archives - Page 62 of 64

3D In Context View all

Will Easing the Chip Shortage Impact New 200mm Fabs?

Aug 09, 2022 · By Dean Freeman · 3D In Context

Another highlight of SEMICON West centered around 200mm fabs. The 200mm industry has thrived on used equipment. As 200mm memory fabs closed, a significant amount of that equipment made its way to existing or emerging logic lines. Most of these lines process chips that have linewidths, or technology nodes at...

Simply Gobsmacked, The CHIPs Act Passes

Aug 03, 2022 · By Dean Freeman · 3D In Context

It has been a tumultuous month. At the start of July, the CHIPS Act appeared to be going into a summer recess. Pat Gelsinger was playing high-stakes poker with congress, and the chip and wafer fab equipment industry was still extremely optimistic going into SEMICON West. As we exit July...

Takeaways from the SEMICON West Sustainability Summit

Jul 20, 2022 · By Dean Freeman · 3D In Context

One of my go-to statements when it comes to sustainability comes from a famous frog, “It’s not easy being green”. The Sustainability Summit at SEMICON west 2022 discussed and demonstrated some of the challenges the industrial world is facing to meet the challenges of reducing greenhouse gas (GHG) emissions and...

Semiconductor Growth: Is the Future Too Bright?

Jul 07, 2022 · By Dean Freeman · 3D In Context

SEMICON West 2022 coming up next week will kick-off, at least for the time being, the back to post-COVID normal for SEMI events. SEMI will be back on its normal schedule, and as concerns regarding COVID 19 are on a slow simmer, healthy attendance should be expected. We can expect...

Francoise in 3D View all

What does the Passing of the CHIPS and Science Act Mean for Advanced Packaging?

Jul 28, 2022 · By Francoise von Trapp · Blogs

I usually leave this sort of commentary to Phil Garrou and Dean Freeman. But after a year of debate and revisions, the CHIPS and Science Act (Formerly the CHIPS Act), has made it to President Biden’s desk, and who knows, by the time you read this, he may have signed...

SEMICON West 2022: Keynotes and Conversations

Jul 18, 2022 · By Francoise von Trapp · Blogs

Is it over already? SEMICON West 2022 flew by, true to form. My week was filled with keynotes and conversations with many movers and shakers in the semiconductor industry and beyond. Here are my initial observations and takeaways, with lots more to come in our upcoming podcast episodes. It’s a...

The Importance of Building Trusted and Secure Microelectronics: A Conversation with Tom Smelker

Jul 14, 2022 · By Francoise von Trapp · Blogs

In a recent podcast episode, I interviewed Tom Smelker, of Mercury Microsystems, about the company’s role in providing safe and secure advanced packaging technologies for the UD DoD, as part of the SHIP program. SHIP stands for State-of-the-Art Heterogeneous Integrated Packaging. The company just opened a new facility in Phoenix...

Why Chiplets aren’t your Grandparents MCMs and Other Takeaways from IMAPS Advanced SiP 2022

Jun 28, 2022 · By Francoise von Trapp · Blogs

As I listened to keynote speakers and panelists at the recent 2022 IMAPS Advanced SiP Conference talk about the commercialization of chiplet technologies, I felt a sense of déjà vu. The key takeaways of the talks and panel discussions sounded eerily familiar. And then it hit me: these were the...

From Different Dimensions View all

Sustainability at SEMICON West: Design, Processing, and Collaboration

Aug 08, 2022 · By Julia Goldstein · Blogs

It is encouraging that SEMI is paying more attention to environmental issues. As Dean Freeman reported, SEMICON West devoted an entire day to the topic at its Sustainability Summit, led by Bhat. There was also a Materials and Sustainability panel discussion the previous day. I gave a talk called “How to...

The Kiterocket Lounge Was the Place to Be at SEMICON West 2022

Aug 02, 2022 · By Andrew DePoy · Blogs

From July 12-14, 2022, SEMICON West was back in full swing after the COVID years, and while I’m not certain about activities and overall energy on the show floor, I do know the Kiterocket Lounge was humming with activity once again. As we had done in years prior to COVID,...

China’s Semiconductor Technology Is More Advanced Than Expected

Jul 27, 2022 · By Kiterocket · Blogs

After reading updates on numerous projects being launched in China, it comes as no surprise that according to Canadian tech analysis firm Tech Insights, China’s semiconductor technology is more advanced than ever. Its top chip maker has gained the ability to produce 7nm chips. Despite US sanctions China’s growing semiconductor market...

How AI & Machine Learning Are Reshaping the Way Transit Systems Move Traffic Patterns

Jul 25, 2022 · By Timothy Menard · Blogs

Of the many ways artificial intelligence (AI) and machine learning are poised to improve modern life, the promise of impacting mass transit is significant. The world is much different compared with the early days of the pandemic, and people around the world are again leveraging mobility and transit systems for...

Packaging IFTLE View all

IFTLE 528: 72nd IEEE ECTC: A Showcase for Hybrid Bonding

Aug 01, 2022 · By Phil Garrou · Blogs

The 72nd IEEE Electronic Components and Technology Conference (ECTC) took place at the end of May in San Diego CA. We all know by now that ECTC is the premier microelectronic packaging conference in the world. While I was not able to attend in person, it was NOT due to...

IFTLE 527: 2nm Chips Scheduled for 2025; Advanced Packaging Becoming More Powerful Industry Segment

Jul 19, 2022 · By Phil Garrou · Blogs

TSMC 2nm Chips Coming in 2025 At its recent North America Technology Symposium TSMC announced that it will begin volume production of 2nm chips by 2025. TSMC’s roadmap is similar to that of its major competitors—Samsung and Intel—which also have reported also have plans to manufacture 2nm chips around 2025....

IFTLE 526: NIST Funds SEMI/UCLA CHIPS HIR Roadmap; China Dumps US Computers

Jul 13, 2022 · By Phil Garrou · Blogs

Another Heterogeneous Integration Roadmap The UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) and SEMI have announced that they have been awarded a $0.3MM grant from NIST to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the US. This is one of the first awards by NIST’s Advanced Manufacturing...

IFTLE 525: Activity at ASE, Amkor, Yole Développement and Adeia (Xperi)

Jun 27, 2022 · By Phil Garrou · Blogs

Let’s continue our look at the key presentations at IMAPS DPC 2022 from ASE, Amkor, Yole Développement and Adeia. ASE Lihong Cao discussed ASE’s “Enhanced Fanout Embedded Bridge Packaging Technology for Chiplet Integration” The packaging industry is looking for alternatives to silicon through silicon via (TSV) technologies. Embedded SI die...

SemiSisters View all

Is Diversity and Inclusion the Secret to Your Company’s Success?

Feb 10, 2022 · By Hemant Taneja · Blogs

Until recently, many companies considered diversity a “nice to have.” Companies supported diversity and inclusion because they wanted to be good citizens because it was the right thing to do, and – for some, cynically – because it was good PR. But now research is proving the business case for...

Smartphone Addiction is Not a Gender-Specific Problem

Jul 26, 2021 · By Francoise von Trapp · Blogs

An open letter to David Benjamin, EE Times Dear David, You really don’t get it. Why? Why, when more women are joining the microelectronics industry in technical and non-technical roles, would you resort to female stereotypes from the 1950s as a vehicle to discuss such an important topic as global...

2021 3D InCites DEI Fundraiser a Success; Thank You Sponsors

Mar 25, 2021 · By Trine Pierik · SemiSisters

We took our annual mural project online this year! Illustrator Ronna Encarnacion created this original watercolor to reflect the importance of Diversity, Equity, and Inclusion in creating sustainability. Proceeds from the project will be used to seed the 3D InCites DEI Fund to support technology businesses owned by women and...

How is COVID 19 Impacting the Semiconductor Industry’s Diversity and Inclusion Efforts?

Aug 20, 2020 · By Francoise von Trapp · Blogs

A headline on CNN Business caught my eye last night: Working mothers are quitting to take care of their kids, and the US job market may never be the same. I started reading and went down a rabbit hole of related articles that revealed a few things: Unlike the recession...

Blogs

SEMI Supports Sustainability Startup Initiative

IFTLE 529: More Hybrid Bonding from ECTC 2022

What You May Have Missed In The CHIPS and Science Act

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